Assembling technique of three dimensional microstructures using clip mechanism of microspring

Kyosuke Kotani, Yusuke Kawai, Chuan Yu Shao, Takahito Ono

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In this paper, a microassembling technique of microstructures using a silicon clip mechanism is developed for a time-of-flight scanning force microscope (TOF-SFM) probe. Microsprings formed by deep reactive ion etching were used as a clip micromechnism. Microelements are manipulated by a manipulator, and microgap between the microspring and opposite wall is expanded by pulling the microspring using a microneedle. Then the microelement is inserted into the micromechnism, and clipped by releasing the microspring. After assembling, all microelements are fixed with conductive glue. This technique is advantageous to fabricate complex three-dimensional microstructures. We demonstrate the assembling of a microelectrode and microcantilever for TOF-SFM probe.

Original languageEnglish
Title of host publication2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011
Pages209-212
Number of pages4
DOIs
Publication statusPublished - 2011 Apr 13
Event24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 - Cancun, Mexico
Duration: 2011 Jan 232011 Jan 27

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

Other24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
Country/TerritoryMexico
CityCancun
Period11/1/2311/1/27

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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