TY - GEN
T1 - Artifacts in the structural analysis of SAB-fabricated interfaces by using focused ion beam
AU - Ohno, Yutaka
AU - Yoshida, Hideto
AU - Kamiuchi, Naoto
AU - Aso, Ryotaro
AU - Takeda, Seiji
AU - Shimizu, Yasuo
AU - Ebisawa, Naoki
AU - Nagai, Yasuyoshi
AU - Liang, Jianbo
AU - Shigekawa, Naoteru
N1 - Funding Information:
This work was supported by JST/CREST (No. JPMJCR17J1). X-STEM and FIB were, respectively, performed at ISIR under the Cooperative Research Program of "Network Joint Research Center for Materials and Devices: Dynamic Alliance for Open Innovation Bridging Human, Environment and Materials" (No. 20183055) and at The Oarai Center under the Inter-University Cooperative Research Program in IMR (No. 18M0045).
Publisher Copyright:
© 2019 JSPS 191st Committee on Innovative Interface Bonding Technology.
PY - 2019/5
Y1 - 2019/5
N2 - Atomistic structure of interfaces fabricated by surface activated bonding (SAB) at room temperature can be modified under the irradiation of a focused ion beam for structural analysis, presumably due to the migration of atoms assisted by point defects that are introduced during the SAB process.
AB - Atomistic structure of interfaces fabricated by surface activated bonding (SAB) at room temperature can be modified under the irradiation of a focused ion beam for structural analysis, presumably due to the migration of atoms assisted by point defects that are introduced during the SAB process.
UR - http://www.scopus.com/inward/record.url?scp=85068394940&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85068394940&partnerID=8YFLogxK
U2 - 10.23919/LTB-3D.2019.8735379
DO - 10.23919/LTB-3D.2019.8735379
M3 - Conference contribution
AN - SCOPUS:85068394940
T3 - Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
SP - 55
BT - Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
Y2 - 21 May 2019 through 25 May 2019
ER -