Ar+H2 atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination

Michitaka Yamamoto; Eiji Higurashi; Tadatomo Suga; Renshi Sawada; Toshihiro Itoh

doi:10.23919/LTB-3D.2017.7947460

Ar+H₂ atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination

Michitaka Yamamoto, Eiji Higurashi, Tadatomo Suga, Renshi Sawada, Toshihiro Itoh

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Au-Au room-temperature bonding in ambient air was demonstrated by applying argon and hydrogen gas mixture (Ar+H₂) atmospheric-pressure (AP) plasma treatment to surface activated bonding. Although conventional Ar low-pressure plasma treatment improved bonding strength only within air exposure for 1 hour, Ar+H2 AP plasma treatment improved the bonding strength even after air exposure for 10 hours.

Original language	English
Title of host publication	Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	64
Number of pages	1
ISBN (Electronic)	9784904743034
DOIs	https://doi.org/10.23919/LTB-3D.2017.7947460
Publication status	Published - 2017 Jun 13
Externally published	Yes
Event	5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan Duration: 2017 May 16 → 2017 May 18

Publication series

Name	Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017

Other

Other	5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
Country/Territory	Japan
City	Tokyo
Period	17/5/16 → 17/5/18

ASJC Scopus subject areas

Electrical and Electronic Engineering
Industrial and Manufacturing Engineering
Electronic, Optical and Magnetic Materials
Surfaces, Coatings and Films

Access to Document

10.23919/LTB-3D.2017.7947460

Cite this

Yamamoto, M., Higurashi, E., Suga, T., Sawada, R., & Itoh, T. (2017). Ar+H₂ atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination. In Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 (pp. 64). [7947460] (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2017.7947460

Ar+H₂ atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination. / Yamamoto, Michitaka; Higurashi, Eiji; Suga, Tadatomo et al.

Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 64 7947460 (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Yamamoto, M, Higurashi, E, Suga, T, Sawada, R & Itoh, T 2017, Ar+H₂ atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination. in Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017., 7947460, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017, Institute of Electrical and Electronics Engineers Inc., pp. 64, 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017, Tokyo, Japan, 17/5/16. https://doi.org/10.23919/LTB-3D.2017.7947460

Yamamoto M, Higurashi E, Suga T, Sawada R, Itoh T. Ar+H₂ atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination. In Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 64. 7947460. (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017). doi: 10.23919/LTB-3D.2017.7947460

Yamamoto, Michitaka ; Higurashi, Eiji ; Suga, Tadatomo et al. / Ar+H₂ atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination. Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 64 (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017).

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