TY - JOUR
T1 - Aqueous electrophoretic deposition of citric-acid-stabilized copper nanoparticles
AU - Yokoyama, Shun
AU - Suzuki, Ippei
AU - Motomiya, Kenichi
AU - Takahashi, Hideyuki
AU - Tohji, Kazuyuki
N1 - Funding Information:
This work is partially supported by JSPS KAKENHI Grant-in-Aid for Young Scientists (B) 15K16155 and (A) 17H04721 .
Publisher Copyright:
© 2018 Elsevier B.V.
PY - 2018/5/20
Y1 - 2018/5/20
N2 - Citric-acid-stabilized copper (Cu) nanoparticles (NPs) were deposited on indium tin oxide (ITO) substrates using aqueous electrophoretic deposition (EPD). Usually, Cu NPs are unstable in aqueous solution because they oxidize and aggregate easily, which is why aqueous EPD has not been used before to deposit them on substrates. However, we showed that treating Cu NPs using citric acid in aqueous solution removed surface oxides and stabilized the surfaces sufficiently. After the treatment, the Cu NPs remained highly stable in aqueous solution even after one week, and this stability was sustained under an electric field in aqueous solution. The Cu NPs were deposited rapidly on ITO substrates by aqueous EPD at a deposition rate that increased with current density (0.25, 0.46, and 0.96 mg/cm2/min at 0.10, 0.20, and 0.30 mA/cm2, respectively). The Cu NP films obtained by the rapid deposition at 0.30 mA/cm2 contained too much water, leading to cracked and low density films. Instead, we demonstrated that a current density of 0.20 mA/cm2 resulted in uniform and high density Cu NP films.
AB - Citric-acid-stabilized copper (Cu) nanoparticles (NPs) were deposited on indium tin oxide (ITO) substrates using aqueous electrophoretic deposition (EPD). Usually, Cu NPs are unstable in aqueous solution because they oxidize and aggregate easily, which is why aqueous EPD has not been used before to deposit them on substrates. However, we showed that treating Cu NPs using citric acid in aqueous solution removed surface oxides and stabilized the surfaces sufficiently. After the treatment, the Cu NPs remained highly stable in aqueous solution even after one week, and this stability was sustained under an electric field in aqueous solution. The Cu NPs were deposited rapidly on ITO substrates by aqueous EPD at a deposition rate that increased with current density (0.25, 0.46, and 0.96 mg/cm2/min at 0.10, 0.20, and 0.30 mA/cm2, respectively). The Cu NP films obtained by the rapid deposition at 0.30 mA/cm2 contained too much water, leading to cracked and low density films. Instead, we demonstrated that a current density of 0.20 mA/cm2 resulted in uniform and high density Cu NP films.
KW - Aqueous solution
KW - Citric acid
KW - Copper nanoparticles
KW - Electrophoretic deposition
KW - Surface modification
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U2 - 10.1016/j.colsurfa.2018.02.056
DO - 10.1016/j.colsurfa.2018.02.056
M3 - Article
AN - SCOPUS:85042649757
VL - 545
SP - 93
EP - 100
JO - Colloids and Surfaces A: Physicochemical and Engineering Aspects
JF - Colloids and Surfaces A: Physicochemical and Engineering Aspects
SN - 0927-7757
ER -