Applications of three-dimensional LSI

Mitsumasa Koyanagi, Takafumi Fukushima, Kang Wook Lee, Tetsu Tanaka

Research output: Contribution to journalReview articlepeer-review

8 Citations (Scopus)


To overcome various concerns due to scaling-down device size in future large-scale integration (LSI), it is indispensable to introduce a new concept of heterogeneous three-dimensional (3D) integration in which various kinds of device chips with different sizes, devices, and materials are vertically stacked. To achieve such heterogeneous 3D integration, the key technology of self-assembly and electrostatic (SAE) bonding has been developed. The heterogeneous 3D integration technology with the SAE bonding method has enabled 3D heterogeneous stacking of different types of chips such as the compound semiconductor device chip, photonic device chip, and spintronic device chip on complementary metal oxide semiconductor chips. A 3D image sensor with extremely fast processing speed and a 3D microprocessor with a self-test and self-repair function for future automatic driving vehicles are typical examples of heterogeneous 3D LSIs which we fabricated by the SAE bonding method.

Original languageEnglish
Pages (from-to)242-247
Number of pages6
JournalMRS Bulletin
Issue number3
Publication statusPublished - 2015 Mar 10


  • Self-assembly
  • bonding
  • polymer
  • reactive ion etching
  • sputtering

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Physical and Theoretical Chemistry


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