Application oriented MEMS

M. Esashi

Research output: Contribution to conferencePaperpeer-review

Abstract

Silicon MEMS as electrostatically levitated rotational gyroscope and 2D optical scanner, and wafer level packaged devices as integrated capacitive pressure sensor and MEMS switch are described. MEMS which use non-silicon materials as LTCC with electrical feedthrough, SiC (silicon carbide) and LiNbO3 for probe card for wafer-level burn-in test, mold for glass press molding and SAW wireless passive sensor respectively are also described.

Original languageEnglish
Pages1325-1328
Number of pages4
Publication statusPublished - 2008 Dec 1
Event15th International Display Workshops, IDW '08 - Niigata, Japan
Duration: 2008 Dec 32008 Dec 5

Other

Other15th International Display Workshops, IDW '08
CountryJapan
CityNiigata
Period08/12/308/12/5

ASJC Scopus subject areas

  • Hardware and Architecture
  • Human-Computer Interaction
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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