Abstract
Silicon MEMS as electrostatically levitated rotational gyroscope and 2D optical scanner, and wafer level packaged devices as integrated capacitive pressure sensor and MEMS switch are described. MEMS which use non-silicon materials as LTCC with electrical feedthrough, SiC (silicon carbide) and LiNbO3 for probe card for wafer-level burn-in test, mold for glass press molding and SAW wireless passive sensor respectively are also described.
| Original language | English |
|---|---|
| Pages | 1325-1328 |
| Number of pages | 4 |
| Publication status | Published - 2008 Dec 1 |
| Event | 15th International Display Workshops, IDW '08 - Niigata, Japan Duration: 2008 Dec 3 → 2008 Dec 5 |
Other
| Other | 15th International Display Workshops, IDW '08 |
|---|---|
| Country | Japan |
| City | Niigata |
| Period | 08/12/3 → 08/12/5 |
ASJC Scopus subject areas
- Hardware and Architecture
- Human-Computer Interaction
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials