Application of micromechanical resonant structures for measuring the sealing of bonded sensor systems

J. Frömel, D. Billep, T. Geßner, M. Wiemer

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

This paper describes the application of a new method to verify the pressure and sealing of cavities in micromechanical components. The new method makes it possible to measure the pressure and the sealing (through measuring the pressure over time) of smallest gasvolumes with the monitoring of the quality factor of integrated micromechanical resonant structures. An example is used that shows the complete process of fabricating such micro mechanical resonant structures to evaluate a bonded structure.

Original languageEnglish
Pages (from-to)481-483
Number of pages3
JournalMicrosystem Technologies
Volume12
Issue number5
DOIs
Publication statusPublished - 2006 Apr 1
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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