Application of lithium niobate etch stop Technology to saw pressure sensors

Andrew B. Randles, Jan H. Kuypers, Masayoshi Esashi, Shuji Tanaka

Research output: Contribution to journalConference article

9 Citations (Scopus)

Abstract

This paper presents a process technology to form thin diaphragms with sealed cavities in a lithium niobate (LiNbOa) wafer, which will be used for small and sensitive SAW-based pressure sensors. The process technology uses thermal inversion, wet stretching with an electroplated Au mask, etch stop at the thermal inversion layer and Au-Au bonding. By the combination of an etch stop and pinhole-free masking, LiNbOa thin diaphragms with thicknesses of several tens of jim to 10 fim were fabricated in 128° Y cut LiNbC 3 wafers. The Au-Au bonding of the LiNbOa wafer gave hermetic sealing. In addition the etch profiles of the LiNbC 3 wafer predicted by Wulff-Jaccodine plots and observed in experiments were compared, and good agreement was confirmed.

Original languageEnglish
Article number4803344
Pages (from-to)1124-1127
Number of pages4
JournalProceedings - IEEE Ultrasonics Symposium
DOIs
Publication statusPublished - 2008 Dec 1
Event2008 IEEE International Ultrasonics Symposium, IUS 2008 - Beijing, China
Duration: 2008 Nov 22008 Nov 5

ASJC Scopus subject areas

  • Acoustics and Ultrasonics

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