Abstract
This paper presents a process technology to form thin diaphragms with sealed cavities in a lithium niobate (LiNbOa) wafer, which will be used for small and sensitive SAW-based pressure sensors. The process technology uses thermal inversion, wet stretching with an electroplated Au mask, etch stop at the thermal inversion layer and Au-Au bonding. By the combination of an etch stop and pinhole-free masking, LiNbOa thin diaphragms with thicknesses of several tens of jim to 10 fim were fabricated in 128° Y cut LiNbC 3 wafers. The Au-Au bonding of the LiNbOa wafer gave hermetic sealing. In addition the etch profiles of the LiNbC 3 wafer predicted by Wulff-Jaccodine plots and observed in experiments were compared, and good agreement was confirmed.
Original language | English |
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Article number | 4803344 |
Pages (from-to) | 1124-1127 |
Number of pages | 4 |
Journal | Proceedings - IEEE Ultrasonics Symposium |
DOIs | |
Publication status | Published - 2008 Dec 1 |
Externally published | Yes |
Event | 2008 IEEE International Ultrasonics Symposium, IUS 2008 - Beijing, China Duration: 2008 Nov 2 → 2008 Nov 5 |
ASJC Scopus subject areas
- Acoustics and Ultrasonics