Abstract
An attempt to evaluate temperature and stress of electronic device encapsulants by impedance spectroscopy method is described. The impedance of the epoxy resins used as electronic packaging material was measured with a simple electrode holder. A basic data to explore a possible application of impedance spectroscopy to evaluate the material properties is produced. Although much work still remains to be done on this new attempt, impedance spectroscopy can provide a useful tool ensure reliability of integrated circuit service.
| Original language | English |
|---|---|
| Pages (from-to) | 133-139 |
| Number of pages | 7 |
| Journal | American Society of Mechanical Engineers, Applied Mechanics Division, AMD |
| Volume | 195 |
| Publication status | Published - 1994 Dec 1 |
| Event | Proceedings of the 1994 International Mechanical Engineering Congress and Exposition - Chicago, IL, USA Duration: 1994 Nov 6 → 1994 Nov 11 |
ASJC Scopus subject areas
- Mechanical Engineering
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Nakajima, M., & Shoji, T. (1994). Application of impedance spectroscopy to evaluate temperature, stress and internal structure in electronic packages. American Society of Mechanical Engineers, Applied Mechanics Division, AMD, 195, 133-139.