Application of impedance spectroscopy to evaluate temperature, stress and internal structure in electronic packages

Mikiko Nakajima, Tetsuo Shoji

Research output: Contribution to journalConference article

Abstract

An attempt to evaluate temperature and stress of electronic device encapsulants by impedance spectroscopy method is described. The impedance of the epoxy resins used as electronic packaging material was measured with a simple electrode holder. A basic data to explore a possible application of impedance spectroscopy to evaluate the material properties is produced. Although much work still remains to be done on this new attempt, impedance spectroscopy can provide a useful tool ensure reliability of integrated circuit service.

Original languageEnglish
Pages (from-to)133-139
Number of pages7
JournalAmerican Society of Mechanical Engineers, Applied Mechanics Division, AMD
Volume195
Publication statusPublished - 1994 Dec 1
EventProceedings of the 1994 International Mechanical Engineering Congress and Exposition - Chicago, IL, USA
Duration: 1994 Nov 61994 Nov 11

ASJC Scopus subject areas

  • Mechanical Engineering

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