An attempt to evaluate temperature and stress of electronic device encapsulants by impedance spectroscopy method is described. The impedance of the epoxy resins used as electronic packaging material was measured with a simple electrode holder. A basic data to explore a possible application of impedance spectroscopy to evaluate the material properties is produced. Although much work still remains to be done on this new attempt, impedance spectroscopy can provide a useful tool ensure reliability of integrated circuit service.
|Number of pages||7|
|Journal||American Society of Mechanical Engineers, Applied Mechanics Division, AMD|
|Publication status||Published - 1994 Dec 1|
|Event||Proceedings of the 1994 International Mechanical Engineering Congress and Exposition - Chicago, IL, USA|
Duration: 1994 Nov 6 → 1994 Nov 11
ASJC Scopus subject areas
- Mechanical Engineering