Antiferromagnetic layer thickness dependence of exchange bias in sputter-deposited Co/CoO/Co trilayer

Jian Wang, Shinji Muraishi, Ji Shi, Yoshio Nakamura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We have used ferromagnet/antiferromagnet/ferromagnet sandwich structure to probe the antiferromagnetic layer thickness dependence of exchange bias in sputter-deposited Co/CoO/Co trilayer. The exchange coupling occurring at the upper ferromagnetic/antiferromagnetic interface is always found to be stronger than the one at the lower antiferromagnetic/ferromagnetic interface. The grain growth with increasing antiferromagnetic layer thickness can lead to a gradient of grain size distribution through the whole antiferromagnetic layer. Consequently, the relatively large grains at the upper interface would results in a rougher interface which we treat as structural defects and can significantly enhance exchange bias through domain state model. The slightly decrease of exchange coupling with increasing antiferromgnetic layer thickness indicates that the exchange bias is only governed by the grains that are thermally stable but whose anisotropy energy is low enough to be set.

Original languageEnglish
Title of host publicationAdvanced Material Science and Technology
PublisherTrans Tech Publications Ltd
Pages1263-1266
Number of pages4
ISBN (Print)9783037850497
DOIs
Publication statusPublished - 2011
Externally publishedYes

Publication series

NameMaterials Science Forum
Volume675 677
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Keywords

  • Antiferromagnetic layer
  • Exchange bias
  • Interface roughness
  • Trilayer structure

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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