Anodically-bondable LTCC substrates with novel nano-structured electrical interconnection for MEMS packaging

Ikusei Rin, W. S. Wang, Luyang Chen, Mingwei Chen, T. Gessner, Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

In this study, anodically-bondable LTCC (low temperature cofired ceramic) substrates are proposed to provide electrical connective packaging by using novel nano-structured gold. On-chip MEMS compatible fabrication of nanoporous gold (NPG) was developed and its porous structure offers sponge-like functions which forms electrical contacts as well during anodic bonding. A MEMS integrated Si substrate is mechanically sealed to a metal feedthrough LTCC substrate by anodic bonding and its electrical connection is formed by the nanoporous structured pads simultaneously.

Original languageEnglish
Title of host publication2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
Pages2351-2354
Number of pages4
DOIs
Publication statusPublished - 2011 Sep 1
Event2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11 - Beijing, China
Duration: 2011 Jun 52011 Jun 9

Publication series

Name2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11

Other

Other2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
CountryChina
CityBeijing
Period11/6/511/6/9

Keywords

  • LTCC
  • MEMS packaging
  • Nanoporous gold
  • anodic bonding

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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