Anisotropic multi-step etching for large-area fabrication of surface microstructures on stainless steel to control thermal radiation

M. Shimizu, T. Yamada, K. Sasaki, A. Takada, H. Nomura, F. Iguchi, H. Yugami

Research output: Contribution to journalArticlepeer-review

9 Citations (Scopus)

Abstract

Controlling the thermal radiation spectra of materials is one of the promising ways to advance energy system efficiency. It is well known that the thermal radiation spectrum can be controlled through the introduction of periodic surface microstructures. Herein, a method for the large-area fabrication of periodic microstructures based on multi-step wet etching is described. The method consists of three main steps, i.e., resist mask fabrication via photolithography, electrochemical wet etching, and side wall protection. Using this method, high-aspect micro-holes (0.82 aspect ratio) arrayed with hexagonal symmetry were fabricated on a stainless steel substrate. The conventional wet etching process method typically provides an aspect ratio of 0.3. The optical absorption peak attributed to the fabricated micro-hole array appeared at 0.8 μm, and the peak absorbance exceeded 0.8 for the micro-holes with a 0.82 aspect ratio. While argon plasma etching in a vacuum chamber was used in the present study for the formation of the protective layer, atmospheric plasma etching should be possible and will expand the applicability of this new method for the large-area fabrication of high-aspect materials.

Original languageEnglish
Article number025001
JournalScience and Technology of Advanced Materials
Volume16
Issue number2
DOIs
Publication statusPublished - 2015 Apr 1

Keywords

  • inteference lithography
  • thermal radiation
  • wet etching

ASJC Scopus subject areas

  • Materials Science(all)

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