Abstract
Photolithography on three-dimensional structures is becoming a key process for realizing new micromechanical devices. Patterning on three-dimensional structures using the conventional mask aligner is a difficult task. In this paper, we present an approach for transferring patterns on cavities prepared by anisotropic etching. A new method of angled exposing is introduced for improving the uniformity of the incident-light-power density transmitted into the resist film deposited on the cavities. This method also reduces the number of reflections coming from the sidewalls of the cavities. Polarized light is used for realizing a pattern on the narrow cavities with a high aspect ratio.
| Original language | English |
|---|---|
| Pages (from-to) | 6449-6453 |
| Number of pages | 5 |
| Journal | Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers |
| Volume | 46 |
| Issue number | 9 B |
| DOIs | |
| Publication status | Published - 2007 Sep 20 |
Keywords
- Angled exposure
- Polarized light
- Reflection
- Spray coating
- Three-dimensional photolithography
ASJC Scopus subject areas
- Engineering(all)
- Physics and Astronomy(all)
Fingerprint Dive into the research topics of 'Angled exposure method for pattering on three-dimensional structures'. Together they form a unique fingerprint.
Cite this
Singh, V. K., Sasaki, M., & Hane, K. (2007). Angled exposure method for pattering on three-dimensional structures. Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 46(9 B), 6449-6453. https://doi.org/10.1143/JJAP.46.6449