Analysis of the temperature and thermal stress in pure tungsten monoblock during heat loading and the influences of alloying and dispersion strengthening on these responses

Makoto Fukuda, Shuhei Nogami, Wenhai Guan, Akira Hasegawa, Takeo Muroga

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

The effects of 3% Re addition and K-bubble dispersion on temperature and stress values and the distributions thereof in a W monoblock during heat loading were investigated using finite element analysis. K-doped W-3%Re exhibited the highest recrystallization resistance but showed a higher surface temperature than pure W or K-doped W during the heat loading. The effect of K-bubble dispersion and 3% Re addition on thermal stress distribution during heat loading was not clearly observed, and residual tensile stress after heat loading, which could possibly cause cracking, was observed at the top surfaces of all materials. Because of the higher strength and temperature at which recrystallization starts for the K-doped W-3%Re and K-doped W, the probability of crack formation at the top surface might be lower compared to that in pure W. The improvement in the material properties and resistance to crack initiation and propagation in W during cyclic heat loading is crucial for the design and development of plasma-facing components. This work suggests possibility of the crack formation in a pure W monoblock in the cooling phase after a 20 MW/m2 heat loading cycle and the effectiveness of K-bubble dispersion and Re addition for improving the heat loading resistance of monoblock W.

Original languageEnglish
Pages (from-to)44-50
Number of pages7
JournalFusion Engineering and Design
Volume107
DOIs
Publication statusPublished - 2016 Jun 1

Keywords

  • Finite element analysis
  • Heat load
  • K-doped W
  • K-doped W-3%Re
  • Monoblock
  • Tungsten

ASJC Scopus subject areas

  • Civil and Structural Engineering
  • Nuclear Energy and Engineering
  • Materials Science(all)
  • Mechanical Engineering

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