Analysis of the formation mechanism of coarse-dense structure of silver paste in die bonding

Shingo Ishihara, Tetsu Takemasa, Katsuaki Suganuma, Junya Kano

Research output: Contribution to journalArticlepeer-review

Fingerprint

Dive into the research topics of 'Analysis of the formation mechanism of coarse-dense structure of silver paste in die bonding'. Together they form a unique fingerprint.

Engineering & Materials Science

Chemical Compounds