Analysis of the effect of heating control conditions on temperature distribution in a wafer during rapid thermal processing with lamp heaters

Shigeki Hirasawa, Tadashi Suzuki, Shigenao Maruyama, Yuhei Takeuchi

Research output: Contribution to journalConference articlepeer-review

4 Citations (Scopus)

Abstract

To unify temperature distribution in a wafer during rapid thermal processing, we calculated the effect of the heating control conditions on temperature distributions in the wafer during heat-up and at steady state by using a program for analyzing three-dimensional radiative heat transfer. We calculated optimum monitoring positions on the wafer in order to minimize the temperature distribution in the wafer. The effects of rotating the wafer, the spacing between the wafer and the shielding ring, the number of monitoring positions, and the initial non-uniform temperature distribution were also calculated. The minimum steady temperature distribution in the wafer at the optimum condition was calculated as ±0.1 K during 100 K/s heat-up and ±0.02 K at 1273 K steady state. We also developed a rapid parallel-computation technique to find the optimum heating control conditions for the whole heating process.

Original languageEnglish
Pages (from-to)37-44
Number of pages8
JournalAmerican Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
Volume369
Issue number6
Publication statusPublished - 2001
Event2001 ASME International Mechanical Engineering Congress and Exposition - New York, NY, United States
Duration: 2001 Nov 112001 Nov 16

ASJC Scopus subject areas

  • Mechanical Engineering
  • Fluid Flow and Transfer Processes

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