Analysis of stress induced voiding using by finite element analysis coupled with finite difference analysis

Haruhisa Shigeyama, A. Toshimitsu Yokobori, Toshihito Ohmi, Takenao Nemoto

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)

    Abstract

    In this paper, the vacancy migration in Cu interconnect of large scale integration caused by stress induced voiding was calculated using the α multiplication method. Then, the effect of weight coefficient, α, on stress induced vacancy diffusion analysis was investigated and the validity of the α multiplication method was verified. Furthermore, the method of the vacancy diffusion analysis coupled with thermal stress analysis which can consider the history of thermal stress due to temperature changes was proposed. The results of the vacancy diffusion analysis coupled with the thermal stress analysis were compared with the analytical results of the vacancy migration without the effect of history of thermal stress. As a result, the maximum site of vacancy accumulation was found to be qualitatively in good agreement between them. However, the quantitative value of maximum vacancy concentration obtained by the vacancy diffusion analysis coupled with thermal stress analysis was found to be much higher and the vacancy distribution is found to be much more localized.

    Original languageEnglish
    Title of host publicationDiffusion in Solids and Liquids VII
    Subtitle of host publicationSolids and Liquids, Mass Transfer - Heat Transfer - Microstructure and Properties - Nanodiffusion and Nanostructured Materials
    PublisherTrans Tech Publications Ltd
    Pages632-640
    Number of pages9
    Volume326-328
    ISBN (Print)9783037854006
    DOIs
    Publication statusPublished - 2012 Jan 1
    Event7th International Conference on Diffusion in Solids and Liquids, Mass Transfer - Heat Transfer - Microstructure and Properties - Nanodiffusion and Nanostructured Materials, DSL 2011 - Algarve, Portugal
    Duration: 2011 Jun 262011 Jun 30

    Other

    Other7th International Conference on Diffusion in Solids and Liquids, Mass Transfer - Heat Transfer - Microstructure and Properties - Nanodiffusion and Nanostructured Materials, DSL 2011
    CountryPortugal
    CityAlgarve
    Period11/6/2611/6/30

    Keywords

    • Stress induced voiding
    • Vacancy diffusion
    • α multiplication method

    ASJC Scopus subject areas

    • Radiation
    • Materials Science(all)
    • Condensed Matter Physics

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