Analysis of intra-chip degital noise coupling path in fully LTE compliant RF receiver test chip

Masahiro Yamaguchi, Peng Fan, Satoshi Tanaka, Sho Muroga, Makoto Nagata

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Intra-electromagnetic noise coupling paths from RF-digital to RF receiver front end can be either of air, wire conduction, Si substrate or package/board. In this paper air and wire conduction coupling paths analysis is discussed. A miniature magnetic near field probe is applied to scan over the test chip to map magnetic near field at LTE band 1(2.1 GHz range). The map is reviewed to extract those on-chip wires that may transfer noise from digital to RF circuits. The extracted wire traces are compared with CAD drawings to build up the FEM simulation model. Each wire is terminated by particular impedance obtained by circuit simulation. The analysis clarified that the magnetic film suppressed conduction noise in on-chip control wires. Simulated total suppression of 11.5 dB well explains the measured suppression of 10 dB.

Original languageEnglish
Title of host publication2015 IEEE International Symposium on Electromagnetic Compatibility, EMC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1007-1011
Number of pages5
ISBN (Electronic)9781479966158
DOIs
Publication statusPublished - 2015 Sep 10
EventIEEE International Symposium on Electromagnetic Compatibility, EMC 2015 - Dresden, Germany
Duration: 2015 Aug 162015 Aug 22

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
Volume2015-Septmber
ISSN (Print)1077-4076
ISSN (Electronic)2158-1118

Other

OtherIEEE International Symposium on Electromagnetic Compatibility, EMC 2015
CountryGermany
CityDresden
Period15/8/1615/8/22

Keywords

  • RF IC
  • conduction noise
  • digital noise
  • magnetic thin film
  • noise suppressor
  • wireless communication

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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