We have investigated the charge-to-hot-carrier degradation (QHCD) in Ge pFinFETs with HfO2/Al2O3/GeO2 gate stacks. The QHCD of Ge pFinFETs has a power-law relationship with drain current at each drain voltage, regardless of gate length. Hot-carrier degradation (HCD) is caused when hot holes generated by impact ionization are trapped in as-grown hole traps  in the GeO2 interfacial layer and the trap sites in HfO2/Al2O3 film. The velocity of hot carriers of Ge is high because the carrier mobility of Ge is high. In the case of high-velocity hot carriers, the detrapping of the trapped carriers occurs at a constant rate. Therefore, the trapping rate of hot carriers depends on the drain current. This is the reason why QHCD has a power-law relationship with drain current. Also, in the case of a high impact ionization rate such as that of Ge, the generation of hot carriers is sensitive to the lateral electric field, which is related to the drain voltage. This is the reason why the power-law relationship of QHCD is determined by drain voltage.