An SOI tactile sensor with a quad seesaw electrode for 3-axis complete differential detection

Y. Hata; Y. Nonomura; H. Funabashi; T. Akashi; M. Fujiyoshi; Y. Omura; T. Nakayama; U. Yamaguchi; H. Yamada; S. Tanaka; H. Fukushi; Masanori Muroyama; M. Makihata; Masayoshi Esashi

doi:10.1109/MEMSYS.2014.6765739

An SOI tactile sensor with a quad seesaw electrode for 3-axis complete differential detection

Y. Hata, Y. Nonomura, H. Funabashi, T. Akashi, M. Fujiyoshi, Y. Omura, T. Nakayama, U. Yamaguchi, H. Yamada, S. Tanaka, H. Fukushi, Masanori Muroyama, M. Makihata, Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

11 Citations (Scopus)

Abstract

This paper presents a novel SOI capacitive tactile sensor with a quad-seesaw electrode for 3-axis complete differential detection, which enables integration with a CMOS. For differentially detecting 3-axis forces, the tactile sensor is composed of four rotating plates individually suspended by torsion beams. In this study, to demonstrate the working principle, we fabricated a test device that integrates an SOI substrate with the quad-seesaw electrode and an anodically bondable LTCC substrate with fixed electrodes as an alternative to the CMOS. The experimental results of the test device successfully demonstrated the working principle as well as 3-axis differential detection with a matrix operation.

Original language	English
Title of host publication	MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	709-712
Number of pages	4
ISBN (Print)	9781479935086
DOIs	https://doi.org/10.1109/MEMSYS.2014.6765739
Publication status	Published - 2014 Jan 1
Event	27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014 - San Francisco, CA, United States Duration: 2014 Jan 26 → 2014 Jan 30

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)	1084-6999

Other

Other	27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014
Country/Territory	United States
City	San Francisco, CA
Period	14/1/26 → 14/1/30

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Mechanical Engineering
Electrical and Electronic Engineering

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10.1109/MEMSYS.2014.6765739

Cite this

Hata, Y., Nonomura, Y., Funabashi, H., Akashi, T., Fujiyoshi, M., Omura, Y., Nakayama, T., Yamaguchi, U., Yamada, H., Tanaka, S., Fukushi, H., Muroyama, M., Makihata, M., & Esashi, M. (2014). An SOI tactile sensor with a quad seesaw electrode for 3-axis complete differential detection. In MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems (pp. 709-712). [6765739] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2014.6765739

An SOI tactile sensor with a quad seesaw electrode for 3-axis complete differential detection. / Hata, Y.; Nonomura, Y.; Funabashi, H. et al.

MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., 2014. p. 709-712 6765739 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Hata, Y, Nonomura, Y, Funabashi, H, Akashi, T, Fujiyoshi, M, Omura, Y, Nakayama, T, Yamaguchi, U, Yamada, H, Tanaka, S, Fukushi, H, Muroyama, M, Makihata, M & Esashi, M 2014, An SOI tactile sensor with a quad seesaw electrode for 3-axis complete differential detection. in MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems., 6765739, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Institute of Electrical and Electronics Engineers Inc., pp. 709-712, 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014, San Francisco, CA, United States, 14/1/26. https://doi.org/10.1109/MEMSYS.2014.6765739

Hata Y, Nonomura Y, Funabashi H, Akashi T, Fujiyoshi M, Omura Y et al. An SOI tactile sensor with a quad seesaw electrode for 3-axis complete differential detection. In MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc. 2014. p. 709-712. 6765739. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMSYS.2014.6765739

Hata, Y. ; Nonomura, Y. ; Funabashi, H. et al. / An SOI tactile sensor with a quad seesaw electrode for 3-axis complete differential detection. MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 709-712 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

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abstract = "This paper presents a novel SOI capacitive tactile sensor with a quad-seesaw electrode for 3-axis complete differential detection, which enables integration with a CMOS. For differentially detecting 3-axis forces, the tactile sensor is composed of four rotating plates individually suspended by torsion beams. In this study, to demonstrate the working principle, we fabricated a test device that integrates an SOI substrate with the quad-seesaw electrode and an anodically bondable LTCC substrate with fixed electrodes as an alternative to the CMOS. The experimental results of the test device successfully demonstrated the working principle as well as 3-axis differential detection with a matrix operation.",

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AU - Yamada, H.

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AB - This paper presents a novel SOI capacitive tactile sensor with a quad-seesaw electrode for 3-axis complete differential detection, which enables integration with a CMOS. For differentially detecting 3-axis forces, the tactile sensor is composed of four rotating plates individually suspended by torsion beams. In this study, to demonstrate the working principle, we fabricated a test device that integrates an SOI substrate with the quad-seesaw electrode and an anodically bondable LTCC substrate with fixed electrodes as an alternative to the CMOS. The experimental results of the test device successfully demonstrated the working principle as well as 3-axis differential detection with a matrix operation.

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An SOI tactile sensor with a quad seesaw electrode for 3-axis complete differential detection

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