TY - GEN
T1 - An SOI tactile sensor with a quad seesaw electrode for 3-axis complete differential detection
AU - Hata, Y.
AU - Nonomura, Y.
AU - Funabashi, H.
AU - Akashi, T.
AU - Fujiyoshi, M.
AU - Omura, Y.
AU - Nakayama, T.
AU - Yamaguchi, U.
AU - Yamada, H.
AU - Tanaka, S.
AU - Fukushi, H.
AU - Muroyama, Masanori
AU - Makihata, M.
AU - Esashi, Masayoshi
PY - 2014/1/1
Y1 - 2014/1/1
N2 - This paper presents a novel SOI capacitive tactile sensor with a quad-seesaw electrode for 3-axis complete differential detection, which enables integration with a CMOS. For differentially detecting 3-axis forces, the tactile sensor is composed of four rotating plates individually suspended by torsion beams. In this study, to demonstrate the working principle, we fabricated a test device that integrates an SOI substrate with the quad-seesaw electrode and an anodically bondable LTCC substrate with fixed electrodes as an alternative to the CMOS. The experimental results of the test device successfully demonstrated the working principle as well as 3-axis differential detection with a matrix operation.
AB - This paper presents a novel SOI capacitive tactile sensor with a quad-seesaw electrode for 3-axis complete differential detection, which enables integration with a CMOS. For differentially detecting 3-axis forces, the tactile sensor is composed of four rotating plates individually suspended by torsion beams. In this study, to demonstrate the working principle, we fabricated a test device that integrates an SOI substrate with the quad-seesaw electrode and an anodically bondable LTCC substrate with fixed electrodes as an alternative to the CMOS. The experimental results of the test device successfully demonstrated the working principle as well as 3-axis differential detection with a matrix operation.
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U2 - 10.1109/MEMSYS.2014.6765739
DO - 10.1109/MEMSYS.2014.6765739
M3 - Conference contribution
AN - SCOPUS:84898931351
SN - 9781479935086
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 709
EP - 712
BT - MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014
Y2 - 26 January 2014 through 30 January 2014
ER -