An SOI tactile sensor with a quad seesaw electrode for 3-axis complete differential detection

Y. Hata, Y. Nonomura, H. Funabashi, T. Akashi, M. Fujiyoshi, Y. Omura, T. Nakayama, U. Yamaguchi, H. Yamada, Shuji Tanaka, H. Fukushi, Masanori Muroyama, M. Makihata, Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Citations (Scopus)

Abstract

This paper presents a novel SOI capacitive tactile sensor with a quad-seesaw electrode for 3-axis complete differential detection, which enables integration with a CMOS. For differentially detecting 3-axis forces, the tactile sensor is composed of four rotating plates individually suspended by torsion beams. In this study, to demonstrate the working principle, we fabricated a test device that integrates an SOI substrate with the quad-seesaw electrode and an anodically bondable LTCC substrate with fixed electrodes as an alternative to the CMOS. The experimental results of the test device successfully demonstrated the working principle as well as 3-axis differential detection with a matrix operation.

Original languageEnglish
Title of host publicationMEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages709-712
Number of pages4
ISBN (Print)9781479935086
DOIs
Publication statusPublished - 2014 Jan 1
Event27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014 - San Francisco, CA, United States
Duration: 2014 Jan 262014 Jan 30

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

Other27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014
Country/TerritoryUnited States
CitySan Francisco, CA
Period14/1/2614/1/30

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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