An investigation of processes for glass micromachining

Research output: Contribution to journalArticlepeer-review

20 Citations (Scopus)


This paper presents processes for glass micromachining, including sandblast, wet etching, reactive ion etching (RIE), and glass reflow techniques. The advantages as well as disadvantages of each method are presented and discussed in light of the experiments. Sandblast and wet etching techniques are simple processes but face difficulties in small and high-aspect-ratio structures. A sandblasted 2 cm × 2 cm Tempax glass wafer with an etching depth of approximately 150 μm is demonstrated. The Tempax glass structure with an etching depth and sides of approximately 20 μm was observed via the wet etching process. The most important aspect of this work was to develop RIE and glass reflow techniques. The current challenges of these methods are addressed here. Deep Tempax glass pillars having a smooth surface, vertical shapes, and a high aspect ratio of 10 with 1-μm-diameter glass pillars, a 2-μm pitch, and a 10-μm etched depth were achieved via the RIE technique. Through-silicon wafer interconnects, embedded inside the Tempax glass, are successfully demonstrated via the glass reflow technique. Glass reflow into large cavities (larger than 100 μm), a micro-trench (0.8-μm wide trench), and a micro-capillary (1-μm diameter) are investigated. An additional optimization of process flow was performed for glass penetration into micro-scale patterns.

Original languageEnglish
Article number51
Issue number3
Publication statusPublished - 2016 Mar 22


  • Glass micromachining
  • Glass reflow process
  • Reactive ion etching
  • Sandblast
  • Wet etching

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering


Dive into the research topics of 'An investigation of processes for glass micromachining'. Together they form a unique fingerprint.

Cite this