An application of thermal microscopes to the measurement of thermal effusivity of films

Kimihito Hatori, Kei Suzuki, Hiroyuki Fukuyama, Hiromichi Ohta

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)

Abstract

The application of thermal microscopes to the measurement of local thermal properties has drawn considerable scientific interest. We report on the application of a thermal microscope to the measurement of thermal effusivity for films comprising alumina deposited on a substrate, which were fabricated by an electrophoretic deposition method. The measured data was analyzed to consider the undulations on the sample surface. The thermal effusivity of these samples was approximately 1 × 103 Js-0.5m-2K-1; this value is smaller than that for dense alumina because the alumina grain makes contact with a point.

Original languageEnglish
Pages (from-to)57-64
Number of pages8
JournalHeat Transfer - Asian Research
Volume38
Issue number1
DOIs
Publication statusPublished - 2009 Jun 4

Keywords

  • Thermal effusivity
  • Thermal microscope
  • Thin film
  • Undulation

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Fluid Flow and Transfer Processes

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