An alternative correlating parameter for creep crack growth rate and its application: Derivation of the parameter Q*

A. Toshimitsu Yokobori, Takeo Yokobori, Tetsuo Nishihara, Toshiaki Yamaoka

    Research output: Contribution to journalArticlepeer-review

    38 Citations (Scopus)

    Abstract

    The parameter Q* has been proposed for correlating or characterizing creep crack growth rate. The creep crack growth rate has been expressed in terms of an activation process equation, and the parameter Q* was defined as the exponent of the exponential in the thermal activation process equation for da/df, in which the activation energy is expressed in terms of free energy. CrMoV steel was used for VAMAS round-robin tests, and other materials such as SUS 304 and the Ni-base alloy of Hastelloy-XR were used. For these materials good correlations are obtained. An analytical conclusion about the effect of thickness on crack growth is described.

    Original languageEnglish
    Pages (from-to)108-118
    Number of pages11
    JournalMaterials at High Temperatures
    Volume10
    Issue number2
    DOIs
    Publication statusPublished - 1992 May

    Keywords

    • Correlating parameter
    • Creep crack growth
    • Thermal activation

    ASJC Scopus subject areas

    • Ceramics and Composites
    • Condensed Matter Physics
    • Mechanics of Materials
    • Mechanical Engineering
    • Metals and Alloys
    • Materials Chemistry

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