An alternative correlating parameter for creep crack growth rate and its application: Derivation of the parameter Q*

A. Toshimitsu Yokobori; Takeo Yokobori; Tetsuo Nishihara; Toshiaki Yamaoka

doi:10.1080/09603409.1992.11689408

An alternative correlating parameter for creep crack growth rate and its application: Derivation of the parameter Q*

A. Toshimitsu Yokobori, Takeo Yokobori, Tetsuo Nishihara, Toshiaki Yamaoka

Research output: Contribution to journal › Article › peer-review

38 Citations (Scopus)

Abstract

The parameter Q* has been proposed for correlating or characterizing creep crack growth rate. The creep crack growth rate has been expressed in terms of an activation process equation, and the parameter Q* was defined as the exponent of the exponential in the thermal activation process equation for da/df, in which the activation energy is expressed in terms of free energy. CrMoV steel was used for VAMAS round-robin tests, and other materials such as SUS 304 and the Ni-base alloy of Hastelloy-XR were used. For these materials good correlations are obtained. An analytical conclusion about the effect of thickness on crack growth is described.

Original language	English
Pages (from-to)	108-118
Number of pages	11
Journal	Materials at High Temperatures
Volume	10
Issue number	2
DOIs	https://doi.org/10.1080/09603409.1992.11689408
Publication status	Published - 1992 May

Keywords

Correlating parameter
Creep crack growth
Thermal activation

ASJC Scopus subject areas

Ceramics and Composites
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys
Materials Chemistry

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title = "An alternative correlating parameter for creep crack growth rate and its application: Derivation of the parameter Q*",

abstract = "The parameter Q* has been proposed for correlating or characterizing creep crack growth rate. The creep crack growth rate has been expressed in terms of an activation process equation, and the parameter Q* was defined as the exponent of the exponential in the thermal activation process equation for da/df, in which the activation energy is expressed in terms of free energy. CrMoV steel was used for VAMAS round-robin tests, and other materials such as SUS 304 and the Ni-base alloy of Hastelloy-XR were used. For these materials good correlations are obtained. An analytical conclusion about the effect of thickness on crack growth is described.",

keywords = "Correlating parameter, Creep crack growth, Thermal activation",

author = "{Toshimitsu Yokobori}, A. and Takeo Yokobori and Tetsuo Nishihara and Toshiaki Yamaoka",

note = "Funding Information: The authors are grateful for permission to use the experimental data obtained by JSPS Committee 129 and from the VAMAS round-robin tests. This research was partly due to the grant-in-aid from the Department of Education (General Research C), and Science and Technology Agency of the Japanese Government. Copyright: Copyright 2016 Elsevier B.V., All rights reserved.",

year = "1992",

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doi = "10.1080/09603409.1992.11689408",

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T2 - Derivation of the parameter Q*

AU - Toshimitsu Yokobori, A.

AU - Yokobori, Takeo

AU - Nishihara, Tetsuo

AU - Yamaoka, Toshiaki

N1 - Funding Information: The authors are grateful for permission to use the experimental data obtained by JSPS Committee 129 and from the VAMAS round-robin tests. This research was partly due to the grant-in-aid from the Department of Education (General Research C), and Science and Technology Agency of the Japanese Government. Copyright: Copyright 2016 Elsevier B.V., All rights reserved.

PY - 1992/5

Y1 - 1992/5

N2 - The parameter Q* has been proposed for correlating or characterizing creep crack growth rate. The creep crack growth rate has been expressed in terms of an activation process equation, and the parameter Q* was defined as the exponent of the exponential in the thermal activation process equation for da/df, in which the activation energy is expressed in terms of free energy. CrMoV steel was used for VAMAS round-robin tests, and other materials such as SUS 304 and the Ni-base alloy of Hastelloy-XR were used. For these materials good correlations are obtained. An analytical conclusion about the effect of thickness on crack growth is described.

AB - The parameter Q* has been proposed for correlating or characterizing creep crack growth rate. The creep crack growth rate has been expressed in terms of an activation process equation, and the parameter Q* was defined as the exponent of the exponential in the thermal activation process equation for da/df, in which the activation energy is expressed in terms of free energy. CrMoV steel was used for VAMAS round-robin tests, and other materials such as SUS 304 and the Ni-base alloy of Hastelloy-XR were used. For these materials good correlations are obtained. An analytical conclusion about the effect of thickness on crack growth is described.

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KW - Creep crack growth

KW - Thermal activation

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