An alternative correlating parameter for creep crack growth rate and its application: Derivation of the parameter Q*

A. Toshimitsu Yokobori, Takeo Yokobori, Tetsuo Nishihara, Toshiaki Yamaoka

Research output: Contribution to journalArticlepeer-review

39 Citations (Scopus)

Abstract

The parameter Q* has been proposed for correlating or characterizing creep crack growth rate. The creep crack growth rate has been expressed in terms of an activation process equation, and the parameter Q* was defined as the exponent of the exponential in the thermal activation process equation for da/df, in which the activation energy is expressed in terms of free energy. CrMoV steel was used for VAMAS round-robin tests, and other materials such as SUS 304 and the Ni-base alloy of Hastelloy-XR were used. For these materials good correlations are obtained. An analytical conclusion about the effect of thickness on crack growth is described.

Original languageEnglish
Pages (from-to)108-118
Number of pages11
JournalMaterials at High Temperatures
Volume10
Issue number2
DOIs
Publication statusPublished - 1992 May
Externally publishedYes

Keywords

  • Correlating parameter
  • Creep crack growth
  • Thermal activation

ASJC Scopus subject areas

  • Ceramics and Composites
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

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