TY - JOUR
T1 - An alternative correlating parameter for creep crack growth rate and its application
T2 - Derivation of the parameter Q*
AU - Toshimitsu Yokobori, A.
AU - Yokobori, Takeo
AU - Nishihara, Tetsuo
AU - Yamaoka, Toshiaki
N1 - Funding Information:
The authors are grateful for permission to use the experimental data obtained by JSPS Committee 129 and from the VAMAS round-robin tests. This research was partly due to the grant-in-aid from the Department of Education (General Research C), and Science and Technology Agency of the Japanese Government.
PY - 1992/5
Y1 - 1992/5
N2 - The parameter Q* has been proposed for correlating or characterizing creep crack growth rate. The creep crack growth rate has been expressed in terms of an activation process equation, and the parameter Q* was defined as the exponent of the exponential in the thermal activation process equation for da/df, in which the activation energy is expressed in terms of free energy. CrMoV steel was used for VAMAS round-robin tests, and other materials such as SUS 304 and the Ni-base alloy of Hastelloy-XR were used. For these materials good correlations are obtained. An analytical conclusion about the effect of thickness on crack growth is described.
AB - The parameter Q* has been proposed for correlating or characterizing creep crack growth rate. The creep crack growth rate has been expressed in terms of an activation process equation, and the parameter Q* was defined as the exponent of the exponential in the thermal activation process equation for da/df, in which the activation energy is expressed in terms of free energy. CrMoV steel was used for VAMAS round-robin tests, and other materials such as SUS 304 and the Ni-base alloy of Hastelloy-XR were used. For these materials good correlations are obtained. An analytical conclusion about the effect of thickness on crack growth is described.
KW - Correlating parameter
KW - Creep crack growth
KW - Thermal activation
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U2 - 10.1080/09603409.1992.11689408
DO - 10.1080/09603409.1992.11689408
M3 - Article
AN - SCOPUS:84975011686
VL - 10
SP - 108
EP - 118
JO - Materials at High Temperatures
JF - Materials at High Temperatures
SN - 0960-3409
IS - 2
ER -