Aluminum reflow behavior in via-hole filling investigated by molecular dynamics simulation and computer graphics

Ryo Yamauchi, Akira Endou, Masahiko Katagiri, Momoji Kubo, Aandras Stirling, Akira Miyamoto, Tomohiro Ohta

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)

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Physics & Astronomy

Engineering & Materials Science