AlN epitaxial film on 6H-SiC(0001) using MOCVD for GHz-band saw devices

K. Uehara, C. M. Yang, T. Furusho, S. K. Kim, Suguru Kameda, Hiroyuki Nakase, S. Nishino, K. Tsubouchi

Research output: Contribution to journalConference article

10 Citations (Scopus)

Abstract

Aluminum nitride (AlN)(0001) epitaxial films on 6H-silicon carbide (SiC)(0001) were successfully grown using metal-organic-chemical-vapor deposition (MO-CVD). Crack-free on the surface of AlN films were obtained without preannealing for removal of polishing-induced damage from the 6H-SiC(0001) substrate. The crack-free AlN films were grown at 1100°C under V-III ratio of 25000. A SAW device was fabricated on the AlN film using photolithography and reactive ion etching (RIE) techniques. The thickness of AlN film was 1.0μm. The direction of SAW propagation was a-axis of AlN. The line and space of IDT was 0.6μm. The center frequency was measured to be 2.747GHz. The phase velocity was calculated to be nearly equal 6600m/sec. The phase velocity in AlN(0001)/6H-Si C(0001) structure is larger than that of AlN(0001)/sapphire(0001) structure under same thickness and direction of SAW propagation.

Original languageEnglish
Pages (from-to)905-908
Number of pages4
JournalProceedings of the IEEE Ultrasonics Symposium
Volume1
Publication statusPublished - 2003 Dec 1
Event2003 IEEE Ultrasonics Symposium - Proceedings - Honolulu, HI, United States
Duration: 2003 Oct 52003 Oct 8

ASJC Scopus subject areas

  • Acoustics and Ultrasonics

Fingerprint Dive into the research topics of 'AlN epitaxial film on 6H-SiC(0001) using MOCVD for GHz-band saw devices'. Together they form a unique fingerprint.

  • Cite this

    Uehara, K., Yang, C. M., Furusho, T., Kim, S. K., Kameda, S., Nakase, H., Nishino, S., & Tsubouchi, K. (2003). AlN epitaxial film on 6H-SiC(0001) using MOCVD for GHz-band saw devices. Proceedings of the IEEE Ultrasonics Symposium, 1, 905-908.