All lead free IGBT module with excellent reliability

Y. Nishimura, K. Oonishi, A. Morozumi, E. Mochizuki, Y. Takahashi

Research output: Contribution to journalConference articlepeer-review

8 Citations (Scopus)

Abstract

The subject of lead free solder application of IGBT module is reliability of solder under the insulated substrate in temperature cycling test. This paper presents all lead free IGBT module with excellent reliability. This was achieved by optimizing of the thermal expansion coefficient of insulated substrate and using Sn-Ag-In solder.

Original languageEnglish
Article numberHV2-4
Pages (from-to)79-82
Number of pages4
JournalProceedings of the International Symposium on Power Semiconductor Devices and ICs
Publication statusPublished - 2005 Nov 22
Externally publishedYes
Event17th International Symposium on Power Semiconductor Devices and ICs, ISPSD'05 - Sanata Barbara, CA, United States
Duration: 2005 May 232005 May 26

ASJC Scopus subject areas

  • Engineering(all)

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