All lead free IGBT module with excellent reliability

Y. Nishimura; K. Oonishi; A. Morozumi; E. Mochizuki; Y. Takahashi

All lead free IGBT module with excellent reliability

Y. Nishimura, K. Oonishi, A. Morozumi, E. Mochizuki, Y. Takahashi

Research output: Contribution to journal › Conference article › peer-review

Abstract

The subject of lead free solder application of IGBT module is reliability of solder under the insulated substrate in temperature cycling test. This paper presents all lead free IGBT module with excellent reliability. This was achieved by optimizing of the thermal expansion coefficient of insulated substrate and using Sn-Ag-In solder.

Original language	English
Article number	HV2-4
Pages (from-to)	79-82
Number of pages	4
Journal	Proceedings of the International Symposium on Power Semiconductor Devices and ICs
Publication status	Published - 2005 Nov 22
Externally published	Yes
Event	17th International Symposium on Power Semiconductor Devices and ICs, ISPSD'05 - Sanata Barbara, CA, United States Duration: 2005 May 23 → 2005 May 26

ASJC Scopus subject areas

Engineering(all)

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@article{1ce15f271f314487a7fc6a730750229a,

title = "All lead free IGBT module with excellent reliability",

abstract = "The subject of lead free solder application of IGBT module is reliability of solder under the insulated substrate in temperature cycling test. This paper presents all lead free IGBT module with excellent reliability. This was achieved by optimizing of the thermal expansion coefficient of insulated substrate and using Sn-Ag-In solder.",

author = "Y. Nishimura and K. Oonishi and A. Morozumi and E. Mochizuki and Y. Takahashi",

year = "2005",

month = nov,

day = "22",

language = "English",

pages = "79--82",

journal = "Proceedings of the International Symposium on Power Semiconductor Devices and ICs",

issn = "1063-6854",

note = "17th International Symposium on Power Semiconductor Devices and ICs, ISPSD'05 ; Conference date: 23-05-2005 Through 26-05-2005",

}

TY - JOUR

T1 - All lead free IGBT module with excellent reliability

AU - Nishimura, Y.

AU - Oonishi, K.

AU - Morozumi, A.

AU - Mochizuki, E.

AU - Takahashi, Y.

PY - 2005/11/22

Y1 - 2005/11/22

N2 - The subject of lead free solder application of IGBT module is reliability of solder under the insulated substrate in temperature cycling test. This paper presents all lead free IGBT module with excellent reliability. This was achieved by optimizing of the thermal expansion coefficient of insulated substrate and using Sn-Ag-In solder.

AB - The subject of lead free solder application of IGBT module is reliability of solder under the insulated substrate in temperature cycling test. This paper presents all lead free IGBT module with excellent reliability. This was achieved by optimizing of the thermal expansion coefficient of insulated substrate and using Sn-Ag-In solder.

UR - http://www.scopus.com/inward/record.url?scp=27744435139&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=27744435139&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:27744435139

SP - 79

EP - 82

JO - Proceedings of the International Symposium on Power Semiconductor Devices and ICs

JF - Proceedings of the International Symposium on Power Semiconductor Devices and ICs

SN - 1063-6854

M1 - HV2-4

T2 - 17th International Symposium on Power Semiconductor Devices and ICs, ISPSD'05

Y2 - 23 May 2005 through 26 May 2005

ER -