Abstract
The subject of lead free solder application of IGBT module is reliability of solder under the insulated substrate in temperature cycling test. This paper presents all lead free IGBT module with excellent reliability. This was achieved by optimizing of the thermal expansion coefficient of insulated substrate and using Sn-Ag-In solder.
| Original language | English |
|---|---|
| Article number | HV2-4 |
| Pages (from-to) | 79-82 |
| Number of pages | 4 |
| Journal | Proceedings of the International Symposium on Power Semiconductor Devices and ICs |
| Publication status | Published - 2005 Nov 22 |
| Externally published | Yes |
| Event | 17th International Symposium on Power Semiconductor Devices and ICs, ISPSD'05 - Sanata Barbara, CA, United States Duration: 2005 May 23 → 2005 May 26 |
ASJC Scopus subject areas
- Engineering(all)