Abstract
Novel back-gate devices, in which the two-dimensional electron gas (2DEG) at the heterointerface is controlled by a voltage applied to the underlying Be-implanted p-type region, are successfully fabricated by using focused Be-ion-beam scanning and MBE overgrowth of an AlGaAs/GaAs modulation-doped structure For the pn-junction-type back-gate structure, the control of the 2DEG is realized without inserting an AlGaAs barrier layer between the 2DEG and the back gate. The Be out-diffusion into the overgrown layer increases with increasing Be ion dose. However, the sharp front of the Be out-diffusion enables us to fabricate the devices with a small separation between the 2DEG and the p-type back gate. Even for a separation less than 150 nm, the damage due to Be out-diffusion is negligibly small. The gate leakage current is small when the back-gate voltage is less than 1.5 V where a forward current starts to flow through the pn junction. Within this voltage limit, the carrier density of the 2DEG was well modified in the range of (1-6) × 1011 cm-2. Trap-filling effects due to a large forward current through the pn-junction-type gates are also discussed.
Original language | English |
---|---|
Pages (from-to) | 1465-1471 |
Number of pages | 7 |
Journal | Semiconductor Science and Technology |
Volume | 12 |
Issue number | 11 |
DOIs | |
Publication status | Published - 1997 Nov 1 |
Externally published | Yes |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry