Aging of Cu-3at% Ti alloys in hydrogen atmosphere: Influence of hydrogen pressure on strength and electrical conductivity

Satoshi Semboshi, Tomoya Nishida, Hiroshi Numakura

Research output: Contribution to journalArticlepeer-review

8 Citations (Scopus)

Abstract

The influence of hydrogen pressure during isothermal aging on the mechanical strength, electrical conductivity, and microstructure of Cu3 at% Ti alloys was investigated under various hydrogen pressures from 0 to 0.8 MPa. The variation of hardness with aging time was not significantly different among all specimens aged under the hydrogen pressures. This is because the hardness is improved primarily by the precipitation strengthening of Cu4Ti particles, which is less affected by hydrogen pressure. The electrical conductivity increased more significantly for specimens aged under higher hydrogen pressure, due to a rapid reduction in the concentration of Ti dissolved in the matrix, which is attributed to the accelerated formation of TiH 2. The conductivity at peak-hardness was improved by a factor of approximately 1.4 in the specimens aged at both 773 and 723 K under the highest hydrogen pressure, compared to that for the specimen aged in vacuum. Therefore, aging under high hydrogen pressure assisted in the significant improvement of both strength and electrical conductivity.

Original languageEnglish
Pages (from-to)605-609
Number of pages5
JournalMaterials Transactions
Volume52
Issue number4
DOIs
Publication statusPublished - 2011 Apr

Keywords

  • Aging
  • Copper-titanium alloy
  • Electrical conductivity
  • Hardness
  • Hydrogen
  • Microstructure
  • Precipitate
  • Transmission electron microscopy

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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