Advances in low-temperature bonding technologies for 3D integration

Tadatomo Suga, Naoteru Shigekawa, Eiji Higurashi, Hideki Takagi, Kazuhiko Shimomura

Research output: Contribution to journalEditorialpeer-review

Original languageEnglish
Article number030200
JournalJapanese journal of applied physics
Volume54
Issue number3
DOIs
Publication statusPublished - 2015 Mar 1
Externally publishedYes

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

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