Advanced TSV filling method with Sn alloy and its reliability

Young Ki Ko, Myong Suk Kang, Hiroyuki Kokawa, Yutaka S. Sato, Sehoon Yoo, Chang Woo Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Advanced TSV filling method with Sn alloy and its reliability'. Together they form a unique fingerprint.

Engineering & Materials Science