Advanced transmission electron microscopy on silver-based conductive adhesive

Naoyuki Kawamoto, Yasukazu Murakami, Daisuke Shindo, Keunsoo Kim, Katsuaki Suganuma

    Research output: Contribution to journalArticlepeer-review

    6 Citations (Scopus)


    Microstructure of a recently developed silver-based conductive adhesive, which is expected as a substitute for conventional soldering, has been studied by advanced transmission electron microscopy (TEM). Energy-filtered TEM has revealed the feature of dispersion of silver particles. Conductivity between neighbored particles is evaluated inside the electron microscope by using two microprobes that can be operated independently. The results shed light on the development of the silver-based conductive adhesive.

    Original languageEnglish
    Pages (from-to)384-388
    Number of pages5
    JournalNippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
    Issue number4
    Publication statusPublished - 2006 Apr


    • Lead-free soldering
    • Packaging materials
    • Silver-based conductive paste
    • Transmission electron microscopy

    ASJC Scopus subject areas

    • Condensed Matter Physics
    • Mechanics of Materials
    • Metals and Alloys
    • Materials Chemistry


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