Advanced die-to-wafer 3D integration platform: Self-assembly technology

Takafumi Fukushima, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingChapter

1 Citation (Scopus)
Original languageEnglish
Title of host publication3D Integration for VLSI Systems
PublisherPan Stanford Publishing Pte. Ltd.
Pages153-174
Number of pages22
ISBN (Print)9789814303811
DOIs
Publication statusPublished - 2011 Sep 30

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Fukushima, T., Lee, K. W., Tanaka, T., & Koyanagi, M. (2011). Advanced die-to-wafer 3D integration platform: Self-assembly technology. In 3D Integration for VLSI Systems (pp. 153-174). Pan Stanford Publishing Pte. Ltd.. https://doi.org/10.4032/9789814303828