Acoustic microscopy for micro electrical interconnections

Hironori Tohmyoh, Tsuyoshi Akaogi, Masumi Saka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper describes on acoustic microscopy for evaluation of micro electrical interconnection. We visualize the joint interface between silicon chip and the printed circuit board by means of acoustic microscopy, and show the limitation in the evaluation of the electrical interconnection by acoustical manner. Also we design the optimum dry-coupling ultrasonic transmission system, and visualize the joint interface under a dry condition.

Original languageEnglish
Title of host publicationProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
Subtitle of host publicationAdvances in Electronic Packaging 2005
Pages1689-1693
Number of pages5
Publication statusPublished - 2006 Feb 23
EventASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States
Duration: 2005 Jul 172005 Jul 22

Publication series

NameProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
VolumePART C

Other

OtherASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Country/TerritoryUnited States
CitySan Francisco, CA
Period05/7/1705/7/22

ASJC Scopus subject areas

  • Engineering(all)

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