Accuracy Enhancement of Sub-mm Chip Self-Alignment Using Liquid Surface Tension for Hybrid Integration

Shinya Kikuta; Satohiko Hoshino; Yoshiki Yamanishi; Takafumi Fukushima; Kangwook Lee; Mitsumasa Koyanagi

Accuracy Enhancement of Sub-mm Chip Self-Alignment Using Liquid Surface Tension for Hybrid Integration

Shinya Kikuta, Satohiko Hoshino, Yoshiki Yamanishi, Takafumi Fukushima, Kangwook Lee, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A self-alignment process of sub-mm chips is studied for hybrid integration toward silicon photonics applications. Capillary forces by liquid surface tension drive the tiny chips to precisely and quickly align on silicon wafers. Self-alignment behaviors and the resulting high accuracies of the sub-mm chips are discussed in this work.

Original language	English
Title of host publication	CLEO
Subtitle of host publication	Science and Innovations, SI 2016
Publisher	Optica Publishing Group (formerly OSA)
ISBN (Electronic)	9781557528209
Publication status	Published - 2016
Event	CLEO: Science and Innovations, SI 2016 - San Jose, United States Duration: 2016 Jun 5 → 2016 Jun 10

Publication series

Name	Optics InfoBase Conference Papers

Conference

Conference	CLEO: Science and Innovations, SI 2016
Country/Territory	United States
City	San Jose
Period	16/6/5 → 16/6/10

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Mechanics of Materials

Cite this

Accuracy Enhancement of Sub-mm Chip Self-Alignment Using Liquid Surface Tension for Hybrid Integration. / Kikuta, Shinya; Hoshino, Satohiko; Yamanishi, Yoshiki et al.

CLEO: Science and Innovations, SI 2016. Optica Publishing Group (formerly OSA), 2016. SM2G.2 (Optics InfoBase Conference Papers).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kikuta, S, Hoshino, S, Yamanishi, Y, Fukushima, T, Lee, K & Koyanagi, M 2016, Accuracy Enhancement of Sub-mm Chip Self-Alignment Using Liquid Surface Tension for Hybrid Integration. in CLEO: Science and Innovations, SI 2016., SM2G.2, Optics InfoBase Conference Papers, Optica Publishing Group (formerly OSA), CLEO: Science and Innovations, SI 2016, San Jose, United States, 16/6/5.

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abstract = "A self-alignment process of sub-mm chips is studied for hybrid integration toward silicon photonics applications. Capillary forces by liquid surface tension drive the tiny chips to precisely and quickly align on silicon wafers. Self-alignment behaviors and the resulting high accuracies of the sub-mm chips are discussed in this work.",

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AU - Lee, Kangwook

AU - Koyanagi, Mitsumasa

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N2 - A self-alignment process of sub-mm chips is studied for hybrid integration toward silicon photonics applications. Capillary forces by liquid surface tension drive the tiny chips to precisely and quickly align on silicon wafers. Self-alignment behaviors and the resulting high accuracies of the sub-mm chips are discussed in this work.

AB - A self-alignment process of sub-mm chips is studied for hybrid integration toward silicon photonics applications. Capillary forces by liquid surface tension drive the tiny chips to precisely and quickly align on silicon wafers. Self-alignment behaviors and the resulting high accuracies of the sub-mm chips are discussed in this work.

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AN - SCOPUS:85136562677

T3 - Optics InfoBase Conference Papers

BT - CLEO

PB - Optica Publishing Group (formerly OSA)

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ER -

Accuracy Enhancement of Sub-mm Chip Self-Alignment Using Liquid Surface Tension for Hybrid Integration

Abstract

Publication series

Conference

ASJC Scopus subject areas

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