Accuracy enhancement of sub-mm chip self-alignment using liquid surface tension for hybrid integration

Shinya Kikuta; Satohiko Hoshino; Yoshiki Yamanishi; Takafumi Fukushima; Kangwook Lee; Mitsumasa Koyanagi

doi:10.1364/cleo_si.2016.sm2g.2

Accuracy enhancement of sub-mm chip self-alignment using liquid surface tension for hybrid integration

Shinya Kikuta, Satohiko Hoshino, Yoshiki Yamanishi, Takafumi Fukushima, Kangwook Lee, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A self-alignment process of sub-mm chips is studied for hybrid integration toward silicon photonics applications. Capillary forces by liquid surface tension drive the tiny chips to precisely and quickly align on silicon wafers. Self-alignment behaviors and the resulting high accuracies of the sub-mm chips are discussed in this work.

Original language	English
Title of host publication	2016 Conference on Lasers and Electro-Optics, CLEO 2016
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781943580118
DOIs	https://doi.org/10.1364/cleo_si.2016.sm2g.2
Publication status	Published - 2016 Dec 16
Event	2016 Conference on Lasers and Electro-Optics, CLEO 2016 - San Jose, United States Duration: 2016 Jun 5 → 2016 Jun 10

Publication series

Name	2016 Conference on Lasers and Electro-Optics, CLEO 2016

Other

Other	2016 Conference on Lasers and Electro-Optics, CLEO 2016
Country	United States
City	San Jose
Period	16/6/5 → 16/6/10

ASJC Scopus subject areas

Atomic and Molecular Physics, and Optics
Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1364/cleo_si.2016.sm2g.2

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Cite this

Kikuta, S., Hoshino, S., Yamanishi, Y., Fukushima, T., Lee, K., & Koyanagi, M. (2016). Accuracy enhancement of sub-mm chip self-alignment using liquid surface tension for hybrid integration. In 2016 Conference on Lasers and Electro-Optics, CLEO 2016 [7788610] (2016 Conference on Lasers and Electro-Optics, CLEO 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1364/cleo_si.2016.sm2g.2

Accuracy enhancement of sub-mm chip self-alignment using liquid surface tension for hybrid integration. / Kikuta, Shinya; Hoshino, Satohiko; Yamanishi, Yoshiki; Fukushima, Takafumi; Lee, Kangwook; Koyanagi, Mitsumasa.

2016 Conference on Lasers and Electro-Optics, CLEO 2016. Institute of Electrical and Electronics Engineers Inc., 2016. 7788610 (2016 Conference on Lasers and Electro-Optics, CLEO 2016).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kikuta, S, Hoshino, S, Yamanishi, Y, Fukushima, T, Lee, K & Koyanagi, M 2016, Accuracy enhancement of sub-mm chip self-alignment using liquid surface tension for hybrid integration. in 2016 Conference on Lasers and Electro-Optics, CLEO 2016., 7788610, 2016 Conference on Lasers and Electro-Optics, CLEO 2016, Institute of Electrical and Electronics Engineers Inc., 2016 Conference on Lasers and Electro-Optics, CLEO 2016, San Jose, United States, 16/6/5. https://doi.org/10.1364/cleo_si.2016.sm2g.2

Kikuta S, Hoshino S, Yamanishi Y, Fukushima T, Lee K, Koyanagi M. Accuracy enhancement of sub-mm chip self-alignment using liquid surface tension for hybrid integration. In 2016 Conference on Lasers and Electro-Optics, CLEO 2016. Institute of Electrical and Electronics Engineers Inc. 2016. 7788610. (2016 Conference on Lasers and Electro-Optics, CLEO 2016). https://doi.org/10.1364/cleo_si.2016.sm2g.2

Kikuta, Shinya ; Hoshino, Satohiko ; Yamanishi, Yoshiki ; Fukushima, Takafumi ; Lee, Kangwook ; Koyanagi, Mitsumasa. / Accuracy enhancement of sub-mm chip self-alignment using liquid surface tension for hybrid integration. 2016 Conference on Lasers and Electro-Optics, CLEO 2016. Institute of Electrical and Electronics Engineers Inc., 2016. (2016 Conference on Lasers and Electro-Optics, CLEO 2016).

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