Accuracy enhancement of sub-mm chip self-alignment using liquid surface tension for hybrid integration

Shinya Kikuta, Satohiko Hoshino, Yoshiki Yamanishi, Takafumi Fukushima, Kangwook Lee, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A self-alignment process of sub-mm chips is studied for hybrid integration toward silicon photonics applications. Capillary forces by liquid surface tension drive the tiny chips to precisely and quickly align on silicon wafers. Self-alignment behaviors and the resulting high accuracies of the sub-mm chips are discussed in this work.

Original languageEnglish
Title of host publication2016 Conference on Lasers and Electro-Optics, CLEO 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781943580118
DOIs
Publication statusPublished - 2016 Dec 16
Event2016 Conference on Lasers and Electro-Optics, CLEO 2016 - San Jose, United States
Duration: 2016 Jun 52016 Jun 10

Publication series

Name2016 Conference on Lasers and Electro-Optics, CLEO 2016

Other

Other2016 Conference on Lasers and Electro-Optics, CLEO 2016
CountryUnited States
CitySan Jose
Period16/6/516/6/10

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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