A wafer-level MEMS-LSI integration platform using fly-cut bonding metals customizable for diverse applications

Hideki Hirano, Yukio Suzuki, Rakesh Chand, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper describes low-temperature metal thermo-compression bonding technology using fly-cut planarized electroplated metal bonding frames for wafer-level integration of heterogeneous elements such as MEMS and CMOS-LSI. The process has a significant advantage over the other established integration processes in vacuum packaging for non-planer (i.e. stepped or micro-structured) wafers and temperature-sensitive fragile wafers. A cost-effective MEMS-LSI integration platform utilizing the developed wafer-level bonding technology for the integration of various MEMS elements with a commercial multi-project CMOS wafer has been also developed. The platform is suitable for the prototyping or small-scale production of future heterogeneously integrated devices such as intelligent and autonomy sensors.

Original languageEnglish
Title of host publicationInternational Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017
EditorsThomas Otto
PublisherMesago Messe Frankfurt GmbH
Pages151-158
Number of pages8
ISBN (Electronic)9783957350572
Publication statusPublished - 2017 Jan 1
EventInternational Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017 - Cork, Ireland
Duration: 2017 Mar 82017 Mar 9

Publication series

NameInternational Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017

Other

OtherInternational Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017
CountryIreland
CityCork
Period17/3/817/3/9

ASJC Scopus subject areas

  • Computer Science Applications
  • Artificial Intelligence
  • Computer Networks and Communications

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  • Cite this

    Hirano, H., Suzuki, Y., Chand, R., & Tanaka, S. (2017). A wafer-level MEMS-LSI integration platform using fly-cut bonding metals customizable for diverse applications. In T. Otto (Ed.), International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017 (pp. 151-158). (International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017). Mesago Messe Frankfurt GmbH.