Abstract
A micromachined thermomechanical relay with Au microspring contact array is presented. Thermally excited Al-SiO2 bimorph cantilevers have been fabricated with micromachining technology. Sputtered Au/Pt/Ti contacts are formed on the tip of the cantilevers and microheaters are built in the cantilevers. In order to reduce the ON-resistance and to avoid the metallic binding between Au contacts, Au microspring contact array is fabricated on Pyrex glass. The fabricated thermomechanical microrelay is operated with input power levels ranging from 20-80 mW at frequencies up to 3 KHz. The ON resistance RON, that includes contact resistance and signal line resistance is in the range of 200-500 mΩ and switching time is about 300 μsec. 107 cycles operation has been performed keeping the RON around 300 mΩ.
| Original language | English |
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| Pages | 220-223 |
| Number of pages | 4 |
| Publication status | Published - 2001 Jan 1 |
| Event | 14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001) - Interlaken, Switzerland Duration: 2001 Jan 21 → 2001 Jan 25 |
Other
| Other | 14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001) |
|---|---|
| Country | Switzerland |
| City | Interlaken |
| Period | 01/1/21 → 01/1/25 |
ASJC Scopus subject areas
- Control and Systems Engineering
- Mechanical Engineering
- Electrical and Electronic Engineering