A thermomechanical relay with microspring contact array

Y. Liu, X. Li, T. Abe, Y. Haga, M. Esashi

Research output: Contribution to conference › Paper

33 Citations (Scopus)

Abstract

A micromachined thermomechanical relay with Au microspring contact array is presented. Thermally excited Al-SiO2 bimorph cantilevers have been fabricated with micromachining technology. Sputtered Au/Pt/Ti contacts are formed on the tip of the cantilevers and microheaters are built in the cantilevers. In order to reduce the ON-resistance and to avoid the metallic binding between Au contacts, Au microspring contact array is fabricated on Pyrex glass. The fabricated thermomechanical microrelay is operated with input power levels ranging from 20-80 mW at frequencies up to 3 KHz. The ON resistance RON, that includes contact resistance and signal line resistance is in the range of 200-500 mΩ and switching time is about 300 μsec. 107 cycles operation has been performed keeping the RON around 300 mΩ.

Original languageEnglish
Pages220-223
Number of pages4
Publication statusPublished - 2001 Jan 1
Event14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001) - Interlaken, Switzerland
Duration: 2001 Jan 21 → 2001 Jan 25

Other

Other14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001)
CountrySwitzerland
CityInterlaken
Period01/1/21 → 01/1/25

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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    Liu, Y., Li, X., Abe, T., Haga, Y., & Esashi, M. (2001). A thermomechanical relay with microspring contact array. 220-223. Paper presented at 14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001), Interlaken, Switzerland.