A thermomechanical relay with microspring contact array

Y. Liu; X. Li; T. Abe; Y. Haga; M. Esashi

A thermomechanical relay with microspring contact array

Y. Liu, X. Li, T. Abe, Y. Haga, M. Esashi

Research output: Contribution to conference › Paper › peer-review

Abstract

A micromachined thermomechanical relay with Au microspring contact array is presented. Thermally excited Al-SiO₂ bimorph cantilevers have been fabricated with micromachining technology. Sputtered Au/Pt/Ti contacts are formed on the tip of the cantilevers and microheaters are built in the cantilevers. In order to reduce the ON-resistance and to avoid the metallic binding between Au contacts, Au microspring contact array is fabricated on Pyrex glass. The fabricated thermomechanical microrelay is operated with input power levels ranging from 20-80 mW at frequencies up to 3 KHz. The ON resistance R_ON, that includes contact resistance and signal line resistance is in the range of 200-500 mΩ and switching time is about 300 μsec. 10⁷ cycles operation has been performed keeping the R_ON around 300 mΩ.

Original language	English
Pages	220-223
Number of pages	4
Publication status	Published - 2001 Jan 1
Event	14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001) - Interlaken, Switzerland Duration: 2001 Jan 21 → 2001 Jan 25

Other

Other	14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001)
Country/Territory	Switzerland
City	Interlaken
Period	01/1/21 → 01/1/25

ASJC Scopus subject areas

Control and Systems Engineering
Mechanical Engineering
Electrical and Electronic Engineering

Cite this

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title = "A thermomechanical relay with microspring contact array",

abstract = "A micromachined thermomechanical relay with Au microspring contact array is presented. Thermally excited Al-SiO2 bimorph cantilevers have been fabricated with micromachining technology. Sputtered Au/Pt/Ti contacts are formed on the tip of the cantilevers and microheaters are built in the cantilevers. In order to reduce the ON-resistance and to avoid the metallic binding between Au contacts, Au microspring contact array is fabricated on Pyrex glass. The fabricated thermomechanical microrelay is operated with input power levels ranging from 20-80 mW at frequencies up to 3 KHz. The ON resistance RON, that includes contact resistance and signal line resistance is in the range of 200-500 mΩ and switching time is about 300 μsec. 107 cycles operation has been performed keeping the RON around 300 mΩ.",

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year = "2001",

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AU - Liu, Y.

AU - Li, X.

AU - Abe, T.

AU - Haga, Y.

AU - Esashi, M.

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Y1 - 2001/1/1

N2 - A micromachined thermomechanical relay with Au microspring contact array is presented. Thermally excited Al-SiO2 bimorph cantilevers have been fabricated with micromachining technology. Sputtered Au/Pt/Ti contacts are formed on the tip of the cantilevers and microheaters are built in the cantilevers. In order to reduce the ON-resistance and to avoid the metallic binding between Au contacts, Au microspring contact array is fabricated on Pyrex glass. The fabricated thermomechanical microrelay is operated with input power levels ranging from 20-80 mW at frequencies up to 3 KHz. The ON resistance RON, that includes contact resistance and signal line resistance is in the range of 200-500 mΩ and switching time is about 300 μsec. 107 cycles operation has been performed keeping the RON around 300 mΩ.

AB - A micromachined thermomechanical relay with Au microspring contact array is presented. Thermally excited Al-SiO2 bimorph cantilevers have been fabricated with micromachining technology. Sputtered Au/Pt/Ti contacts are formed on the tip of the cantilevers and microheaters are built in the cantilevers. In order to reduce the ON-resistance and to avoid the metallic binding between Au contacts, Au microspring contact array is fabricated on Pyrex glass. The fabricated thermomechanical microrelay is operated with input power levels ranging from 20-80 mW at frequencies up to 3 KHz. The ON resistance RON, that includes contact resistance and signal line resistance is in the range of 200-500 mΩ and switching time is about 300 μsec. 107 cycles operation has been performed keeping the RON around 300 mΩ.

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T2 - 14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001)

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ER -

A thermomechanical relay with microspring contact array

Abstract

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ASJC Scopus subject areas

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