A theoretical study of the effect of strain on the electronic structure of dumbbell-shape graphene nanoribbons

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The authors have proposed the formation of dumbbell-shape graphene nanoribbon (DS-GNR) by changing the width of the mid-part of a GNR in order to enhance the stability and reliability of the GNR-based electronic devices. In this study, the electronic band structure of the DS-GNR was analyzed by using the first principle calculation method. Throughout the calculation, the electronic band structures, densities of states, and orbital distributions were examined to describe the electronic properties of DS-GNRs. The band gap of DS-GNRs is different to that of single GNRs because the orbital distributions of the lowest unoccupied molecular orbitals (LUMO) and the highest occupied molecular orbitals (HOMO) in DS-GNRs changed from those in single GNRs. Generally, single GNRs exhibit both the semiconducting and the metallic properties depending on the ribbon width. The magnitude of the band gap of DS-GNRs depends on the difference in the width of narrow part and wide parts, and the variation of the band gap of DS-GNRs was smaller than that of single GNRs. In addition, when a dumbbell-shape GNR undergoes a uniaxial tensile strain, its band gap showed high strain sensitivity as was expected. Therefore, the GNR material with a dumbbell-shape structure has great potential for use in highly sensitive strain sensors.

Original languageEnglish
Title of host publication13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
PublisherIEEE Computer Society
Pages161-164
Number of pages4
ISBN (Electronic)9781538656150
DOIs
Publication statusPublished - 2019 Jan 24
Event13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 - Taipei, Taiwan, Province of China
Duration: 2018 Oct 242018 Oct 26

Publication series

NameProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Volume2018-October
ISSN (Print)2150-5934
ISSN (Electronic)2150-5942

Conference

Conference13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
Country/TerritoryTaiwan, Province of China
CityTaipei
Period18/10/2418/10/26

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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