A study on wettability and formation of intermetallic phase between Co–Cr–Mo alloy and Sn-Solder used as a potential under bump metallization for flip-chip packages

Tin Tin Kyaw, Phacharaphon Tunthawiroon, Kannachai Kanlayasiri, Kenta Yamanaka, Akihiko Chiba

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6 Citations (Scopus)

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