A study on transmission characteristic of signal line with solder-mount on a PCB

Hiroshi Inoue, Ken Ichi Takahashi

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    As a fundamental study of the high frequency printed circuit or wire-bonding, the transmission characteristics and magnetic near field intensity distribution for the modeled printed circuit board (PCB), which have the soldered thin wire line are investigated experimentally. The size of a modeled sample is 30 × 50 mm2 using 1.53 mm glass-epoxy substrate. Basic signal line constructed as 50-ohm characteristic impedance. The soldered thin wire line of 100-micrometer diameter was fabricated at the center of the modeled PCB that simulates the bonding part. S-parameters, i.e. |S21| and |S11|, characteristic impedance measured by the time domain reflectometry and magnetic near field distribution measured by a shielded loop probe are discussed. The length of the thin wire and shape of the strip line and wire-bonding part have significant influence to the characteristic impedance, transmission property and magnetic distribution properties. These results offer the design ways and guidelines for the PCB and parts designing and wiring including solder mounted element and also wire bonding packaging at high frequency applications.

    Original languageEnglish
    Title of host publicationProceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts
    Pages176-183
    Number of pages8
    Publication statusPublished - 2004 Dec 1
    EventProceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts - Seattle, WA, United States
    Duration: 2004 Sep 202004 Sep 23

    Publication series

    NameProceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts

    Conference

    ConferenceProceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts
    CountryUnited States
    CitySeattle, WA
    Period04/9/2004/9/23

    Keywords

    • Magnetic field distribution
    • Printed circuit board
    • Signal line
    • Solde-mount
    • Transmission characteristics
    • Wire bonding

    ASJC Scopus subject areas

    • Engineering(all)

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