A study on the reliability of the chip surface solder joint

Yoshinari Ikeda, Yuji Iizuka, Tatsuhiko Asai, Tomoaki Goto, Yoshikazu Takahashi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

5 Citations (Scopus)

Abstract

The solder joint reliability of IGBT chip surface interconnection with a lead-frame structure is described in the power cycling (P/C) capability which is greatly improved due to a chip surface cooling effect in comparison with aluminum wire interconnection. The lead-frame is joined on a Ni and Au plated chip surface with Sn-Ag or Sn-Sb system solders. The P/C capability obtained with the Sn-Sb system solder is three times larger than that with the Sn-Ag system solder. Such a good performance comes from the solid solution hardening property of Sn-Sb system solder.

Original languageEnglish
Title of host publicationISPSD '08, Proceedings of the 20th International Symposium on Power Semiconductor Devices and IC's
Pages189-192
Number of pages4
DOIs
Publication statusPublished - 2008 Sep 17
Externally publishedYes
EventISPSD '08, 20th International Symposium on Power Semiconductor Devices and IC's - Orlando, FL, United States
Duration: 2008 May 18 → 2008 May 22

Publication series

NameProceedings of the International Symposium on Power Semiconductor Devices and ICs
ISSN (Print)1063-6854

Other

OtherISPSD '08, 20th International Symposium on Power Semiconductor Devices and IC's
CountryUnited States
CityOrlando, FL
Period08/5/18 → 08/5/22

ASJC Scopus subject areas

  • Engineering(all)

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