A study on separation of heat generation and heat transfer related to temperature rise of silver palladium contact

Kazuaki Miyanaga, Yoshiki Kayano, Hiroshi Inoue

    Research output: Contribution to journalArticle

    13 Citations (Scopus)

    Abstract

    In this paper, the separation of heat generation and heat transfer related to temperature rise of silver palladium contact was investigated experimentally in order to predict the temperature rise of contact by the use conditions such as voltage range between 25 to 40 V, current range between 3.2 to 5.0 A and silver palladium alloy (AgPd) materials. Firstly, relationship between temperature rise of contact and supply power was discussed. The effects of heat generation and heat transfer on temperature rise were separated and quantified by least squares method. Secondly, effects of durations and integral powers of bridge and arc on temperature rise were also discussed by changing supply power. Results show that the integral power of the bridge increases when supply power increases. As the supply power increases, integral power of arc also increases. The temperature rise is dominated by integral power of bridge. Remarkable difference of bridge duration can not be seen in the five materials (AgPd 30, AgPd40, AgPd50, AgPd70 and Pd). The supply power is increased, arc duration gets longer. As weight percent of Pd content increases, the effect of supply power on arc duration becomes larger. Consequently, the integral power of arc increases. This study is a basic consideration to realize methods predicting temperature rise of contact.

    Original languageEnglish
    Pages (from-to)1129-1135
    Number of pages7
    JournalIEICE Transactions on Electronics
    VolumeE89-C
    Issue number8
    DOIs
    Publication statusPublished - 2006 Aug

    Keywords

    • Arc discharge
    • Bridge
    • Electrical contact
    • Heat generation
    • Heat transfer
    • Supply power
    • Temperature rise

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Electrical and Electronic Engineering

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