A study on positive photosensitive epoxy resins using reaction development patterning (RDP)

Wei Min Zhou, Takafumi Fukushima, Masao Tomoi, Toshiyuki Oyama

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

In this study, we successfully fabricated positive photosensitive epoxy resins based on the Reaction Development Patterning (RDP) by using B-staged polymers prepared by polyaddition between an epoxy base resin and an acid anhydride curing agent during mixing and prebaking processes. Application of RDP to the B-staged polymers afforded positive fine patterns by the use of 15-mol% sodium 2-aminoethoxide in ethanolamine/NMP mixtures. Furthermore, the fine epoxy patterns were not deformed after heat treatment for complete curing, indicating that the cress-linked epoxy patterns have high tolerability to thermal stresses. These results suggest the possibility of practical application of RDP-based positive photosensitive epoxy resins.

Original languageEnglish
Pages (from-to)713-717
Number of pages5
JournalJournal of Photopolymer Science and Technology
Volume27
Issue number6
DOIs
Publication statusPublished - 2015 Jan 28

Keywords

  • Photosensitive epoxy resin
  • Positive patterns
  • RDP
  • Reaction development patterning

ASJC Scopus subject areas

  • Polymers and Plastics
  • Organic Chemistry
  • Materials Chemistry

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