A parallel ADC for high-speed CMOS image processing system with 3D structure

K. Kiyoyama, Y. Ohara, Kanuku Ri, Y. Yang, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

15 Citations (Scopus)

Abstract

In this paper, we describe the fundamental study of a parallel signal processing circuit, which includes a pixel circuit and a parallel analog-to-digital converter (ADC) with hierarchical correlated double sampling (CDS). To realize high speed image capturing sensor, we have proposed a block-parallel signal processing with three-dimensional (3D) structure. Using 3D structure, the different function layers are stacked vertically and interconnected electrically by through-Si vias (TSVs), which can improve sensor performance and signal band width. On the other hand, the fixed pattern noise (FPN), caused by the circuit device variation, becomes a critical challenge. Experiments on the fabricated pixel circuit have been implemented in a single-layer (two-dimensional) 0.18-μm CMOS image sensor technology. With the analog CDS, the FPN of pixel circuit is reduced by 8.6%. To eliminate the FPN of parallel ADC, a digital CDS technique is implemented. The proposed ADC with digital CDS is designed in a two-dimensional 0.18-μm CMOS technology. The ADC design, including an 8-bit memory, a 6-bit memory, a subtraction circuit, and a comparator, occupies 100×100μm 2 area and 0.9mW with supply voltage 1.8 V and 1 MS/s conversion rate. The functional simulation and measurement results confirm that our techniques can effectively reduce fixed pattern noise.

Original languageEnglish
Title of host publication2009 IEEE International Conference on 3D System Integration, 3DIC 2009
DOIs
Publication statusPublished - 2009 Dec 1
Event2009 IEEE International Conference on 3D System Integration, 3DIC 2009 - San Francisco, CA, United States
Duration: 2009 Sep 282009 Sep 30

Publication series

Name2009 IEEE International Conference on 3D System Integration, 3DIC 2009

Other

Other2009 IEEE International Conference on 3D System Integration, 3DIC 2009
CountryUnited States
CitySan Francisco, CA
Period09/9/2809/9/30

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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