TY - JOUR
T1 - A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface
AU - Haubold, M.
AU - Lin, Y. C.
AU - Frömel, J.
AU - Wiemer, M.
AU - Esashi, M.
AU - Geßner, T.
N1 - Funding Information:
The author wants to thank the German Academic Exchange Service (DAAD) and the World Premier International Research Center Initiative at Tohoku University in Sendai/Japan for funding the research project and the kind support.
PY - 2012/4
Y1 - 2012/4
N2 - The use of tantalum as adhesion layer for Au/Si eutectic bonding was investigated and compared to the frequently used materials chromium or titanium in the case of oxidized silicon substrates. Suitable test structures have been fabricated, bonded and evaluated. The eutectically bonded chips were characterized in respect to the maximum bearable tensile and shear loading. Interfacial reactions were observed by SEM and optical microscopy. As asignificant result when tantalum was used, the external load until fracture occurred could be increased up to a factor of 3 in comparison to usually applied chromium or titanium. Analyses after bonding gave no prove for diffusion between the metallic alloy and the adhesion layer and delamination could be minimized therefore.
AB - The use of tantalum as adhesion layer for Au/Si eutectic bonding was investigated and compared to the frequently used materials chromium or titanium in the case of oxidized silicon substrates. Suitable test structures have been fabricated, bonded and evaluated. The eutectically bonded chips were characterized in respect to the maximum bearable tensile and shear loading. Interfacial reactions were observed by SEM and optical microscopy. As asignificant result when tantalum was used, the external load until fracture occurred could be increased up to a factor of 3 in comparison to usually applied chromium or titanium. Analyses after bonding gave no prove for diffusion between the metallic alloy and the adhesion layer and delamination could be minimized therefore.
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U2 - 10.1007/s00542-012-1440-1
DO - 10.1007/s00542-012-1440-1
M3 - Article
AN - SCOPUS:84862781366
VL - 18
SP - 515
EP - 521
JO - Microsystem Technologies
JF - Microsystem Technologies
SN - 0946-7076
IS - 4
ER -