A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface

M. Haubold; Ikusei Rin; J. Frömel; M. Wiemer; M. Esashi; T. Geßner

doi:10.1007/s00542-012-1440-1

A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface

M. Haubold, Ikusei Rin, J. Frömel, M. Wiemer, M. Esashi, T. Geßner

Micro System Integration Center (μSIC)

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

Abstract

The use of tantalum as adhesion layer for Au/Si eutectic bonding was investigated and compared to the frequently used materials chromium or titanium in the case of oxidized silicon substrates. Suitable test structures have been fabricated, bonded and evaluated. The eutectically bonded chips were characterized in respect to the maximum bearable tensile and shear loading. Interfacial reactions were observed by SEM and optical microscopy. As asignificant result when tantalum was used, the external load until fracture occurred could be increased up to a factor of 3 in comparison to usually applied chromium or titanium. Analyses after bonding gave no prove for diffusion between the metallic alloy and the adhesion layer and delamination could be minimized therefore.

Original language	English
Pages (from-to)	515-521
Number of pages	7
Journal	Microsystem Technologies
Volume	18
Issue number	4
DOIs	https://doi.org/10.1007/s00542-012-1440-1
Publication status	Published - 2012 Apr 1

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Hardware and Architecture
Electrical and Electronic Engineering

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T1 - A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface

AU - Haubold, M.

AU - Rin, Ikusei

AU - Frömel, J.

AU - Wiemer, M.

AU - Esashi, M.

AU - Geßner, T.

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AB - The use of tantalum as adhesion layer for Au/Si eutectic bonding was investigated and compared to the frequently used materials chromium or titanium in the case of oxidized silicon substrates. Suitable test structures have been fabricated, bonded and evaluated. The eutectically bonded chips were characterized in respect to the maximum bearable tensile and shear loading. Interfacial reactions were observed by SEM and optical microscopy. As asignificant result when tantalum was used, the external load until fracture occurred could be increased up to a factor of 3 in comparison to usually applied chromium or titanium. Analyses after bonding gave no prove for diffusion between the metallic alloy and the adhesion layer and delamination could be minimized therefore.

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