TY - GEN
T1 - A newly developed cooling system using hydrogenated water
AU - Yamazaki, Y.
AU - Yokoi, I.
AU - Abe, T.
AU - Ii, T.
AU - Hirayama, M.
AU - Ohmi, T.
N1 - Publisher Copyright:
© 1999 IEEE.
PY - 1999
Y1 - 1999
N2 - This paper presents the copper oxidation and flowing out characteristics inside copper pipe line, which is a candidate for future cooling water pipe line, with various species of dissolved gases in cooling water. The result reveals that copper oxidation rate in air saturated ultrapure water is much faster than other conditions, whereas its rate in hydrogenated ultrapure water is not differentiated from that in de-Aerated ultrapure water. However, the amount of copper flowed out from the pipe surface is drastically reduced by using hydrogenated ultrapure water. The data indicate that copper in neutral pH solution with the oxidation reduction potential (ORP) value of 400 mV such as hydrogenated ultrapure water is perfectly stable for surface oxidation. As a cooling water has many kinds of advantages: it is not necessary to use chemicals as anti-corrosive agents; there is no cooling efficiency degradation by oxidation inside pipe line surface, and a "maintenance-free system" can be realised. A newly developed cooling system using hydrogenated ultrapure water is applicable to other industry facilities as well as semiconductor fabrication with major benefits in terms of the "industrial cost" and "the environmental issues".
AB - This paper presents the copper oxidation and flowing out characteristics inside copper pipe line, which is a candidate for future cooling water pipe line, with various species of dissolved gases in cooling water. The result reveals that copper oxidation rate in air saturated ultrapure water is much faster than other conditions, whereas its rate in hydrogenated ultrapure water is not differentiated from that in de-Aerated ultrapure water. However, the amount of copper flowed out from the pipe surface is drastically reduced by using hydrogenated ultrapure water. The data indicate that copper in neutral pH solution with the oxidation reduction potential (ORP) value of 400 mV such as hydrogenated ultrapure water is perfectly stable for surface oxidation. As a cooling water has many kinds of advantages: it is not necessary to use chemicals as anti-corrosive agents; there is no cooling efficiency degradation by oxidation inside pipe line surface, and a "maintenance-free system" can be realised. A newly developed cooling system using hydrogenated ultrapure water is applicable to other industry facilities as well as semiconductor fabrication with major benefits in terms of the "industrial cost" and "the environmental issues".
UR - http://www.scopus.com/inward/record.url?scp=0033320301&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0033320301&partnerID=8YFLogxK
U2 - 10.1109/ISSM.1999.808825
DO - 10.1109/ISSM.1999.808825
M3 - Conference contribution
AN - SCOPUS:0033320301
T3 - 1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999 - Conference Proceedings
SP - 417
EP - 420
BT - 1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999 - Conference Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999
Y2 - 11 October 1999 through 13 October 1999
ER -