A newly developed cooling system using hydrogenated water

Y. Yamazaki; I. Yokoi; T. Abe; T. Ii; M. Hirayama; T. Ohmi

doi:10.1109/ISSM.1999.808825

A newly developed cooling system using hydrogenated water

Y. Yamazaki, I. Yokoi, T. Abe, T. Ii, M. Hirayama, T. Ohmi

New Industry Creation Hatchery Center (NICHe)

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

This paper presents the copper oxidation and flowing out characteristics inside copper pipe line, which is a candidate for future cooling water pipe line, with various species of dissolved gases in cooling water. The result reveals that copper oxidation rate in air saturated ultrapure water is much faster than other conditions, whereas its rate in hydrogenated ultrapure water is not differentiated from that in de-Aerated ultrapure water. However, the amount of copper flowed out from the pipe surface is drastically reduced by using hydrogenated ultrapure water. The data indicate that copper in neutral pH solution with the oxidation reduction potential (ORP) value of 400 mV such as hydrogenated ultrapure water is perfectly stable for surface oxidation. As a cooling water has many kinds of advantages: it is not necessary to use chemicals as anti-corrosive agents; there is no cooling efficiency degradation by oxidation inside pipe line surface, and a "maintenance-free system" can be realised. A newly developed cooling system using hydrogenated ultrapure water is applicable to other industry facilities as well as semiconductor fabrication with major benefits in terms of the "industrial cost" and "the environmental issues".

Original language	English
Title of host publication	1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999 - Conference Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	417-420
Number of pages	4
ISBN (Electronic)	0780354036, 9780780354036
DOIs	https://doi.org/10.1109/ISSM.1999.808825
Publication status	Published - 1999 Jan 1
Event	1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999 - Santa Clara, United States Duration: 1999 Oct 11 → 1999 Oct 13

Publication series

Name	1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999 - Conference Proceedings

Other

Other	1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999
Country	United States
City	Santa Clara
Period	99/10/11 → 99/10/13

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Safety, Risk, Reliability and Quality
Process Chemistry and Technology
Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/ISSM.1999.808825

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Cite this

Yamazaki, Y., Yokoi, I., Abe, T., Ii, T., Hirayama, M., & Ohmi, T. (1999). A newly developed cooling system using hydrogenated water. In 1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999 - Conference Proceedings (pp. 417-420). [808825] (1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999 - Conference Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISSM.1999.808825

A newly developed cooling system using hydrogenated water. / Yamazaki, Y.; Yokoi, I.; Abe, T.; Ii, T.; Hirayama, M.; Ohmi, T.

1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 1999. p. 417-420 808825 (1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999 - Conference Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Yamazaki, Y, Yokoi, I, Abe, T, Ii, T, Hirayama, M & Ohmi, T 1999, A newly developed cooling system using hydrogenated water. in 1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999 - Conference Proceedings., 808825, 1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999 - Conference Proceedings, Institute of Electrical and Electronics Engineers Inc., pp. 417-420, 1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999, Santa Clara, United States, 99/10/11. https://doi.org/10.1109/ISSM.1999.808825

Yamazaki Y, Yokoi I, Abe T, Ii T, Hirayama M, Ohmi T. A newly developed cooling system using hydrogenated water. In 1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc. 1999. p. 417-420. 808825. (1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999 - Conference Proceedings). https://doi.org/10.1109/ISSM.1999.808825

Yamazaki, Y. ; Yokoi, I. ; Abe, T. ; Ii, T. ; Hirayama, M. ; Ohmi, T. / A newly developed cooling system using hydrogenated water. 1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 1999. pp. 417-420 (1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999 - Conference Proceedings).

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N2 - This paper presents the copper oxidation and flowing out characteristics inside copper pipe line, which is a candidate for future cooling water pipe line, with various species of dissolved gases in cooling water. The result reveals that copper oxidation rate in air saturated ultrapure water is much faster than other conditions, whereas its rate in hydrogenated ultrapure water is not differentiated from that in de-Aerated ultrapure water. However, the amount of copper flowed out from the pipe surface is drastically reduced by using hydrogenated ultrapure water. The data indicate that copper in neutral pH solution with the oxidation reduction potential (ORP) value of 400 mV such as hydrogenated ultrapure water is perfectly stable for surface oxidation. As a cooling water has many kinds of advantages: it is not necessary to use chemicals as anti-corrosive agents; there is no cooling efficiency degradation by oxidation inside pipe line surface, and a "maintenance-free system" can be realised. A newly developed cooling system using hydrogenated ultrapure water is applicable to other industry facilities as well as semiconductor fabrication with major benefits in terms of the "industrial cost" and "the environmental issues".

AB - This paper presents the copper oxidation and flowing out characteristics inside copper pipe line, which is a candidate for future cooling water pipe line, with various species of dissolved gases in cooling water. The result reveals that copper oxidation rate in air saturated ultrapure water is much faster than other conditions, whereas its rate in hydrogenated ultrapure water is not differentiated from that in de-Aerated ultrapure water. However, the amount of copper flowed out from the pipe surface is drastically reduced by using hydrogenated ultrapure water. The data indicate that copper in neutral pH solution with the oxidation reduction potential (ORP) value of 400 mV such as hydrogenated ultrapure water is perfectly stable for surface oxidation. As a cooling water has many kinds of advantages: it is not necessary to use chemicals as anti-corrosive agents; there is no cooling efficiency degradation by oxidation inside pipe line surface, and a "maintenance-free system" can be realised. A newly developed cooling system using hydrogenated ultrapure water is applicable to other industry facilities as well as semiconductor fabrication with major benefits in terms of the "industrial cost" and "the environmental issues".

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