A new wafer scale chip-on-chip (W-COC) packaging technology using adhesive injection method

Hiroyuki Kurino, Kang Wook Lee, Katsuyuki Sakuma, Tomonori Nakamura, Mitsumasa Koyanagi

Research output: Contribution to journalArticlepeer-review

19 Citations (Scopus)

Abstract

In order to realize low cost and high density packaging technology, we propose a new wafer scale chip-on-chip (W-COC) packaging technology using the adhesive injection method. In W-COC packaging technology, chip-on-chip modules more than two hundreds are simultaneously formed at the wafer level. In addition, we can significantly improve the chip performance, because small micro-bumps, more than one million, can be formed on a chip and consequently a number of vertical interconnections can be formed between the two bonded chips. Therefore, it is very easy to introduce the parallel processing function in a W-COC module. Using this technology, we propose a new multichip module (MCM) consisting of single or multiple memory chips directly attached to a logic chip. In this paper, we describe key technologies to realize this new multichip module. We fabricated the W-COC test module and investigated its electrical performance using a micro-bump chain.

Original languageEnglish
Pages (from-to)2406-2410
Number of pages5
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume38
Issue number4 B
DOIs
Publication statusPublished - 1999

Keywords

  • Chip size package (CSP)
  • Multichip module (MCM)
  • Wafer scale chip-on-chip

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

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