A new systematic method of characterization for the strength of thin films on substrates - Evaluation of mechanical propertiesn by means of 'film projection'

S. Kamiya, H. Kimura, K. Yamanobe, Masumi Saka, H. Abé

Research output: Contribution to journalArticle

26 Citations (Scopus)

Abstract

The strength of a thin film deposited on a substrate should be recognized as the strength of a materials system which is made of a film, a substrate and an interface. The macroscopic fracture of this system should be controlled by the strength of the film and the interface, as well as the residual stress and elastic properties in/of the film. We have developed a systematic method of measurement for all these properties by means of a specimen with 'film projection'. By applying external load to the film projecting a little out of the edge of the substrate, cracks can be introduced exclusively in the film or along the interface. The strength of film and interface is independently evaluated in terms of toughness on the basis of crack extension resistance. Deformation of the film projection gives its Young's modulus, and the buckling behavior is used to estimate the residual stress. As an application example of the method, those properties mentioned above were evaluated for the case of a diamond film deposited on a cobalt-cemented tungsten carbide cutting tool.

Original languageEnglish
Pages (from-to)91-98
Number of pages8
JournalThin Solid Films
Volume414
Issue number1
DOIs
Publication statusPublished - 2002 Jul 1

Keywords

  • Adhesion
  • Diamond
  • Elastic properties
  • Stress

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

Fingerprint Dive into the research topics of 'A new systematic method of characterization for the strength of thin films on substrates - Evaluation of mechanical propertiesn by means of 'film projection''. Together they form a unique fingerprint.

Cite this