A new device of abrasive jet machining and application to abrasive jet printer

Tsunemoto Kuriyagawa; Takashi Sakuyama; Katsuo Syoji; Hiromitsu Onodera

A new device of abrasive jet machining and application to abrasive jet printer

Tsunemoto Kuriyagawa, Takashi Sakuyama, Katsuo Syoji, Hiromitsu Onodera

MEN - Biomedical Engineering

Research output: Contribution to journal › Article › peer-review

11 Citations (Scopus)

Abstract

A new abrasive jet machining (AJM) device has been developed for precise etching and patterning of hard and brittle materials, such as ceramics, glass and silicon. However, since conventional AJM devices cannot control precisely the amount of blasting abrasives, applying this method to precision machining has been difficult. Moreover, in the machining of small holes, colliding abrasives accumulate in the bottom of the hole, preventing the direct impact of successive abrasives onto the workpiece. As a result, the machining efficiency decreases as the machining progresses. In the present paper, the machining characteristics of the new AJM device are investigated, and direct etching and patterning of glass without masking are demonstrated.

Original language	English
Pages (from-to)	103-110
Number of pages	8
Journal	Key Engineering Materials
Volume	196
Publication status	Published - 2001 Jan 1

Keywords

Abrasive Jet Machining
Blasting
Direct Etching
Micro-Mechanical Fabrication

ASJC Scopus subject areas

Materials Science(all)
Mechanics of Materials
Mechanical Engineering

Fingerprint Dive into the research topics of 'A new device of abrasive jet machining and application to abrasive jet printer'. Together they form a unique fingerprint.

Cite this

@article{47b789b9a73d48c7a0f1d677cd7e492d,

title = "A new device of abrasive jet machining and application to abrasive jet printer",

abstract = "A new abrasive jet machining (AJM) device has been developed for precise etching and patterning of hard and brittle materials, such as ceramics, glass and silicon. However, since conventional AJM devices cannot control precisely the amount of blasting abrasives, applying this method to precision machining has been difficult. Moreover, in the machining of small holes, colliding abrasives accumulate in the bottom of the hole, preventing the direct impact of successive abrasives onto the workpiece. As a result, the machining efficiency decreases as the machining progresses. In the present paper, the machining characteristics of the new AJM device are investigated, and direct etching and patterning of glass without masking are demonstrated.",

keywords = "Abrasive Jet Machining, Blasting, Direct Etching, Micro-Mechanical Fabrication",

author = "Tsunemoto Kuriyagawa and Takashi Sakuyama and Katsuo Syoji and Hiromitsu Onodera",

year = "2001",

month = jan,

day = "1",

language = "English",

volume = "196",

pages = "103--110",

journal = "Key Engineering Materials",

issn = "1013-9826",

publisher = "Trans Tech Publications",

}

TY - JOUR

T1 - A new device of abrasive jet machining and application to abrasive jet printer

AU - Kuriyagawa, Tsunemoto

AU - Sakuyama, Takashi

AU - Syoji, Katsuo

AU - Onodera, Hiromitsu

PY - 2001/1/1

Y1 - 2001/1/1

N2 - A new abrasive jet machining (AJM) device has been developed for precise etching and patterning of hard and brittle materials, such as ceramics, glass and silicon. However, since conventional AJM devices cannot control precisely the amount of blasting abrasives, applying this method to precision machining has been difficult. Moreover, in the machining of small holes, colliding abrasives accumulate in the bottom of the hole, preventing the direct impact of successive abrasives onto the workpiece. As a result, the machining efficiency decreases as the machining progresses. In the present paper, the machining characteristics of the new AJM device are investigated, and direct etching and patterning of glass without masking are demonstrated.

AB - A new abrasive jet machining (AJM) device has been developed for precise etching and patterning of hard and brittle materials, such as ceramics, glass and silicon. However, since conventional AJM devices cannot control precisely the amount of blasting abrasives, applying this method to precision machining has been difficult. Moreover, in the machining of small holes, colliding abrasives accumulate in the bottom of the hole, preventing the direct impact of successive abrasives onto the workpiece. As a result, the machining efficiency decreases as the machining progresses. In the present paper, the machining characteristics of the new AJM device are investigated, and direct etching and patterning of glass without masking are demonstrated.

KW - Abrasive Jet Machining

KW - Blasting

KW - Direct Etching

KW - Micro-Mechanical Fabrication

UR - http://www.scopus.com/inward/record.url?scp=0035124932&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0035124932&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:0035124932

VL - 196

SP - 103

EP - 110

JO - Key Engineering Materials

JF - Key Engineering Materials

SN - 1013-9826

ER -

A new device of abrasive jet machining and application to abrasive jet printer

Abstract

Keywords

ASJC Scopus subject areas

Other files and links

Cite this