Abstract
A new bulk silicon micromachining suitable for accelerometer and other micromechanical structures is developed. By combining deep RIE, P++ diffusion and anisotropic wet etching, surface thin beam structures can be fabricated. This process is applied for small sized and high performance capacitive accelerometer packaged by anodic bonding.
Original language | English |
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Pages (from-to) | 420-424 |
Number of pages | 5 |
Journal | IEEJ Transactions on Sensors and Micromachines |
Volume | 118 |
Issue number | 9 |
DOIs | |
Publication status | Published - 1998 |
Keywords
- Accelerometer
- Anisotropic wet etching
- Deep RIE
ASJC Scopus subject areas
- Mechanical Engineering
- Electrical and Electronic Engineering