A new bulk-micromachining using deep RIE and wet etching for an accelerometer

Geunbae Lim; Seogsoon Back; Masayoshi Esashi

doi:10.1541/ieejsmas.118.420

A new bulk-micromachining using deep RIE and wet etching for an accelerometer

Geunbae Lim, Seogsoon Back, Masayoshi Esashi

Micro System Integration Center (μSIC)

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Abstract

A new bulk silicon micromachining suitable for accelerometer and other micromechanical structures is developed. By combining deep RIE, P⁺⁺ diffusion and anisotropic wet etching, surface thin beam structures can be fabricated. This process is applied for small sized and high performance capacitive accelerometer packaged by anodic bonding.

Original language	English
Pages (from-to)	420-424
Number of pages	5
Journal	IEEJ Transactions on Sensors and Micromachines
Volume	118
Issue number	9
DOIs	https://doi.org/10.1541/ieejsmas.118.420
Publication status	Published - 1998

Keywords

Accelerometer
Anisotropic wet etching
Deep RIE

ASJC Scopus subject areas

Mechanical Engineering
Electrical and Electronic Engineering

Access to Document

10.1541/ieejsmas.118.420

Cite this

@article{0dd5275ebb3f425c933d23987674b131,

title = "A new bulk-micromachining using deep RIE and wet etching for an accelerometer",

abstract = "A new bulk silicon micromachining suitable for accelerometer and other micromechanical structures is developed. By combining deep RIE, P++ diffusion and anisotropic wet etching, surface thin beam structures can be fabricated. This process is applied for small sized and high performance capacitive accelerometer packaged by anodic bonding.",

keywords = "Accelerometer, Anisotropic wet etching, Deep RIE",

author = "Geunbae Lim and Seogsoon Back and Masayoshi Esashi",

year = "1998",

doi = "10.1541/ieejsmas.118.420",

language = "English",

volume = "118",

pages = "420--424",

journal = "IEEJ Transactions on Sensors and Micromachines",

issn = "1341-8939",

publisher = "The Institute of Electrical Engineers of Japan",

number = "9",

}

TY - JOUR

T1 - A new bulk-micromachining using deep RIE and wet etching for an accelerometer

AU - Lim, Geunbae

AU - Back, Seogsoon

AU - Esashi, Masayoshi

PY - 1998

Y1 - 1998

N2 - A new bulk silicon micromachining suitable for accelerometer and other micromechanical structures is developed. By combining deep RIE, P++ diffusion and anisotropic wet etching, surface thin beam structures can be fabricated. This process is applied for small sized and high performance capacitive accelerometer packaged by anodic bonding.

AB - A new bulk silicon micromachining suitable for accelerometer and other micromechanical structures is developed. By combining deep RIE, P++ diffusion and anisotropic wet etching, surface thin beam structures can be fabricated. This process is applied for small sized and high performance capacitive accelerometer packaged by anodic bonding.

KW - Accelerometer

KW - Anisotropic wet etching

KW - Deep RIE

UR - http://www.scopus.com/inward/record.url?scp=85010120482&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85010120482&partnerID=8YFLogxK

U2 - 10.1541/ieejsmas.118.420

DO - 10.1541/ieejsmas.118.420

M3 - Article

AN - SCOPUS:85010120482

VL - 118

SP - 420

EP - 424

JO - IEEJ Transactions on Sensors and Micromachines

JF - IEEJ Transactions on Sensors and Micromachines

SN - 1341-8939

IS - 9

ER -

A new bulk-micromachining using deep RIE and wet etching for an accelerometer

Abstract

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this