A new bulk silicon micromachining suitable for accelerometer and other micromechanical structures is developed. By combining deep RIE, P++ diffusion and anisotropic wet etching, surface thin beam structures can be fabricated. This process is applied for small sized and high performance capacitive accelerometer packaged by anodic bonding.
- Anisotropic wet etching
- Deep RIE
ASJC Scopus subject areas
- Mechanical Engineering
- Electrical and Electronic Engineering