A new bulk-micromachining using deep RIE and wet etching for an accelerometer

Geunbae Lim; Seogsoon Back; Masayoshi Esashi

doi:10.1541/ieejsmas.118.420

A new bulk-micromachining using deep RIE and wet etching for an accelerometer

Geunbae Lim, Seogsoon Back, Masayoshi Esashi

Micro System Integration Center (μSIC)

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Abstract

A new bulk silicon micromachining suitable for accelerometer and other micromechanical structures is developed. By combining deep RIE, P⁺⁺ diffusion and anisotropic wet etching, surface thin beam structures can be fabricated. This process is applied for small sized and high performance capacitive accelerometer packaged by anodic bonding.

Original language	English
Pages (from-to)	420-424
Number of pages	5
Journal	IEEJ Transactions on Sensors and Micromachines
Volume	118
Issue number	9
DOIs	https://doi.org/10.1541/ieejsmas.118.420
Publication status	Published - 1998

Keywords

Accelerometer
Anisotropic wet etching
Deep RIE

ASJC Scopus subject areas

Mechanical Engineering
Electrical and Electronic Engineering

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abstract = "A new bulk silicon micromachining suitable for accelerometer and other micromechanical structures is developed. By combining deep RIE, P++ diffusion and anisotropic wet etching, surface thin beam structures can be fabricated. This process is applied for small sized and high performance capacitive accelerometer packaged by anodic bonding.",

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A new bulk-micromachining using deep RIE and wet etching for an accelerometer

Abstract

Keywords

ASJC Scopus subject areas

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