A new bulk-micromachining using deep RIE and wet etching for an accelerometer

Geunbae Lim, Seogsoon Back, Masayoshi Esashi

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)

Abstract

A new bulk silicon micromachining suitable for accelerometer and other micromechanical structures is developed. By combining deep RIE, P++ diffusion and anisotropic wet etching, surface thin beam structures can be fabricated. This process is applied for small sized and high performance capacitive accelerometer packaged by anodic bonding.

Original languageEnglish
Pages (from-to)420-424
Number of pages5
JournalIEEJ Transactions on Sensors and Micromachines
Volume118
Issue number9
DOIs
Publication statusPublished - 1998

Keywords

  • Accelerometer
  • Anisotropic wet etching
  • Deep RIE

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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